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Rohm & Haas Co.Mitsubishi Materials Corp.Tokin Corp. /JP/Sanken Electric Co., Ltd.Noritake Co., Ltd.Toshiba Electronic Devices & Storage Corp.Wolverine World Wide, Inc.Fujimi, Inc.Institute of Electrical Engineering, Chinese Academy of SciencesInstitute of Electrical Engineering, Chinese Academy of SciencesTowa Corp.Tokai Carbon Co., Ltd.MillerKnoll, Inc.Toyo Tanso Co., Ltd.CoorsTek, Inc.JCET Group Co., Ltd.Hitachi Power Semiconductor Device Ltd.Metglas, Inc.Hyperion Catalysis International, Inc.SAGE Electrochromics, Inc.Physik Instrumente (PI) GmbH & Co. KGNovaled GmbHNippon Carbon Co., Ltd.Nikko-Materials Co., Ltd.Amkor Technology, Inc.Research Frontiers, Inc.Hanwha Advanced Materials Corp.SK EnpulseYangzhou Yangjie Electronic Technology Co., Ltd.GTAT Corp.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.