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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Boe Innovation Investment Co. Ltd.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.LG Display Co., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Applied Materials, Inc.Micron Technology, Inc.Fraunhofer-Gesellschaft eVShin-Etsu Chemical Co., Ltd.TOPPAN Holdings, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.TDK Corp.
Intel Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Motorola, Inc.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyChina Mobile Communications Group Co., Ltd.MediaTek, Inc.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.HTC Corp.China Telecom Corp. Ltd.Nubia Technology Co., Ltd.KDDI Corp.Guangzhou Shiyuan Electronic Technology Co. Ltd.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsEricsson, Inc.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.Xilinx, Inc.Broadcom Corp.
Toyota Motor Corp.Honda Motor Co., Ltd.DENSO Corp.Hyundai Motor Co., Ltd.Nissan Motor Co., Ltd.Kia Corp.LG Display Co., Ltd.Mazda Motor Corp.Kobe Steel, Ltd.Bayerische Motoren Werke AG3M Co.Sumitomo Wiring Systems (U.S.A.), Inc.Volkswagen Group of America, Inc.ZF Friedrichshafen AGAisin Corp.Toyota Industries Corp.AUDI AGShowa Denko Materials Co. Ltd.Goodyear Tire & Rubber Co.Mitsubishi Motors Corp.Resonac Corp.Hitachi Metals, Ltd.Subaru Corp.The Yokohama Rubber Co., Ltd.Subaru Corp.The Yokohama Rubber Co., Ltd.BYD Co., Ltd.Zhejiang Geely Holding Group Co., Ltd.Niterra Co., Ltd.Eaton Corp.
Shri Ramdeobaba College of Engineering & ManagementAethertek Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.LG Display Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Shin-Etsu Chemical Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Showa Denko Materials Co. Ltd.Resonac Corp.STMicroelectronics SASumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
Harman International Industries, Inc.EM Microelectronic-Marin SARGB Systems, Inc.Aehr Test SystemsObjectVideo, Inc.QSC LLCPixelplus Co., Ltd.Magellan Systems Japan, Inc.InteraXon, Inc.Digital Signal Corp.Lake Technology Ltd.Digital:Convergence CorporationBOPS, Inc.JAZiO, Inc.AudioAsics A/SAbaco Systems Ltd.Quickfilter Technologies, Inc.EqcoLogic NVTheseus Logic, Inc.Theseus Logic, Inc.Actiwave ABVirtualLogix, Inc.Santronics, Inc.Intersect Technologies, Inc.Beijing Zhongke Haoxin Technology Co. Ltd.Power Tagging Technologies, Inc.Axiocom, Inc.ADM, Inc.Value Burger Systems, Inc.Texas Memory Systems, Inc.