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International Business Machines Corp.Fujitsu Ltd.Eastman Kodak Co.Google LLCMicrosoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Beijing Xiaomi Mobile Software Co., Ltd.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Deutsche Telekom AGDeutsche Telekom AGGemalto, Inc.Sega Group Corp.Beijing Jingdong Shangke Information Technology Co., Ltd.Beijing Jingdong Shangke Information Technology Co., Ltd.Orion Co., Ltd.LEGO A/SLEGO A/SCitrix Systems, Inc.NetEase (Hangzhou) Network Co., Ltd.Altera Corp.SK Planet Co., Ltd.Avaya, Inc.HGST, Inc.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.Sandvik AktiebolagOlivetti SpASaudi Basic Industries Corp.CA Technologies, Inc.
LIG Nex1 Co., Ltd.Raytheon Co.Nokia Siemens Networks OyTokin Corp. /JP/National University of Defense TechnologyNational University of Defense TechnologyAsahi Kasei Microdevices Corp.Guangdong Galanz Enterprises Co., Ltd.New Japan Radio Co., Ltd.Nisshinbo Micro Devices, Inc.Leica Geosystems AGL3Harris Technologies ASA Ltd.Roke Manor Research Ltd.Israel Aerospace Industries Ltd.Keysight Technologies, Inc.MCI, Inc.MCI, Inc.USG Interiors LLCAselsan Elektronik Sanayi ve Ticaret ASMACOM Technology Solutions Holdings, Inc.Vaisala OyjSun Create Electronics Co., Ltd.WM Motor Technology Co., Ltd.Rheinmetall Air Defence AGShanghai Hesai Technology Co., LtdGuangzhou Haige Communications Group Inc. Co.Guangzhou Haige Communications Group Inc. Co.China North Industries Corp.Shenzhen Silver Basis Technology Co., Ltd.Beijing Rigol Electronic Co. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
Electronics & Telecommunications Research InstituteYamaha Corp.JVCKenwood Corp.Semiconductor Components Industries LLCAlpine Electronics, Inc.Japan Radio Co. Ltd.Skyworks Solutions, Inc.Harman International Industries, Inc.Rohde & Schwarz GmbH & Co. KGJOLED, Inc.Primax Electronics Ltd.Toshiba Electronic Devices & Storage Corp.Onkyo Home Entertainment Corp.Cirrus Logic, Inc.AVIC Jonhon Optronic Technology Co., Ltd.AVIC Jonhon Optronic Technology Co., Ltd.Heraeus Precious Metals GmbH & Co. KGSonos, Inc.GTE Sylvania, Inc.GTE Sylvania, Inc.STMicroelectronics International NVNuvoton Technology Corp.DX Antenna Co., Ltd.Bang & Olufsen A/SShenzhen Topband Co., Ltd.PPC Broadband, Inc.Shenzhen Sunway Communication Co., Ltd.Shenzhen Sunway Communication Co., Ltd.Shenzhen H&T Intelligent Control Co., Ltd.MACOM Technology Solutions Holdings, Inc.
Nichia Corp.Fujitsu Semiconductor Ltd.Skyworks Solutions, Inc.Dowa Electronics Materials Co., Ltd.Novuton Technology Corp. JapanSumitomo Electric Device Innovations, Inc.GlobalWafers Co., Ltd.MACOM Technology Solutions Holdings, Inc.NTT Advanced Technology Corp.Hitachi Power Semiconductor Device Ltd.RichWave Technology Corp.Xiamen Changelight Co., Ltd.NeoPhotonics Corp.Ampleon Netherlands BVXiamen San'an Integrated Circuit Co., Ltd.TriQuint Semiconductor, Inc.Xiamen San'an Integrated Circuit Co., Ltd.Win Semiconductors Corp.IQE PlcFreiberger Compound Materials GmbHEfficient Power Conversion Corp.Transphorm Technology, Inc.SILTECTRA GmbHPhysical Sciences, Inc.Shanghai Simgui Technology Co., Ltd.Shanghai Simgui Technology Co., Ltd.RFHIC Corp.United Monolithic Semiconductors SASDenseLight Semiconductors Pte Ltd.Avogy, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.China Telecom Corp. Ltd.