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Thales GroupRaytheon Co.Hewlett Packard Enterprise Development LPMotorola Solutions, Inc.Hangzhou H3C Technologies Co., Ltd.Juniper Networks, Inc.NUCTECH Co., Ltd.Lear Corp.SRI InternationalBundesdruckerei GmbHChina Academy of Telecommunications TechnologyBull SAMcAfee LLCHuizhou Desay SV Automotive Co., Ltd.Neusoft Corp.Huizhou Desay SV Automotive Co., Ltd.Roke Manor Research Ltd.Hangzhou DPtech Technologies Co., Ltd.Qi An Xin Technology Group, Inc.Hangzhou DPtech Technologies Co., Ltd.Irdeto BVSplunk, Inc.Beijing Topsec Network Security Technology Co. Ltd.S-1 Corp. (Korea)S-1 Corp. (Korea)ELTA Systems Ltd.Akamai Technologies, Inc.Beijing Topsec Network Security Technology Co. Ltd.Fortinet, Inc.Intertrust Technologies Corp.
Hangzhou H3C Technologies Co., Ltd.Enterasys Networks, Inc.Acacia Communications, Inc.Pulse Secure LLCThales DIS CPL USA, Inc.WatchGuard Technologies, Inc.SonicWALL, Inc.NIKSUN, Inc.Tumbleweed Communications Corp.Clearswift Ltd.Columbitech ABNetMotion Software, Inc.Internet Security Systems, Inc.Techstep ASAPacketLight Networks Ltd.Radio IP Software, Inc.Array Networks, Inc.Chrysalis-ITS, Inc.Sistech SA
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
thyssenkrupp Industrial Solutions AGSMS group GmbHSTATS ChipPAC Pte Ltd.HYUNDAI ROTEM Co.ChipMOS Technologies, Inc.MULTIVAC Sepp Haggenmüller SE & Co. KGSaipem SAChroma Ate, Inc.Mühlbauer GmbH & Co. KGHarnischfeger Corp.Ansaldo Energia SpAEd. Züblin AGBWG Bergwerk- und Walzwerk-Maschinenbau GmbHSuzhou Secote Precision Electronic Co., Ltd.Imagineering, Inc.Geico SpAClextral SASHenan Communications Planning & Design Institute Co., Ltd.Hosokawa Alpine AGHydro International Ltd.Doris Engineering SAConverteam SASLingzhi Environmental Protection Co., Ltd.Danieli Automation SpALanzhou LS Heavy Equipment Co., Ltd.Lanzhou LS Heavy Equipment Co., Ltd.Lingzhi Environmental Protection Co., Ltd.Leclanché SAMH Robot & Automation Co., Ltd.MH Robot & Automation Co., Ltd.
