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Toyota Motor Corp.Seiko Epson Corp.Honda Motor Co., Ltd.DENSO Corp.Midea Group Co. Ltd.FANUC Corp.Iseki & Co., Ltd.YASKAWA Electric Corp.SZ DJI Technology Co., Ltd.JD.com, Inc.Miele & Cie. KGMattel, Inc.Husqvarna ABLEGO A/SLEGO A/SBando Chemical Industries Ltd.National Aeronautics & Space AdministrationThe Shenzhen Institutes of Advanced TechnologyQinetiQ Ltd.The Shenzhen Institutes of Advanced TechnologyRenishaw PlcSRI InternationalShenyang Institute of AutomationShibuya Corp.Nitto Kohki Co., Ltd.Tatsuno Corp.Nachi-Fujikoshi Corp.Bozhon Precision Industry Technology Co., Ltd.Bozhon Precision Industry Technology Co., Ltd.KEYENCE Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University