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International Business Machines Corp.Fujitsu Ltd.Tencent Technology (Shenzhen) Co., Ltd.Yokogawa Electric Corp.Oracle America, Inc.Hewlett Packard Enterprise Development LPSeagate Technology LLCDelphi Technology, Inc.Praxair S.T. Technology, Inc.Life Technologies Corp.Juniper Networks, Inc.Unisys Corp.Tata Consultancy Services Ltd.Inspur Electronic Information Industry Co., Ltd.Avaya, Inc.MiTAC International Corp.Siemens Medical Solutions USA, Inc.Heroku, Inc.Agfa-Gevaert NVLandmark Graphics Corp.Fiberhome Telecommunication Technologies Co., Ltd.Shima Seiki Mfg. Ltd.Shima Seiki Mfg. Ltd.NARI Technology Co., Ltd.Rambus, Inc.Canon Marketing Japan, Inc.HRL Laboratories LLCBull SANEC Soft Ltd.Peking University Founder Group Corp.
Shinano Kenshi Co., Ltd.Shinano Kenshi Co., Ltd.Videojet Technologies Ltd.Kawasaki Microelectronics, Inc.OFS Fitel LLCFaraday Technology Corp.Foxlink Image Technology Co., Ltd.TOVIS Co., Ltd.Measurement Specialties, Inc.Prolific Technology, Inc.ABOV Semiconductor Co., Ltd.Twinhead International Corp.Kotura, Inc.Hyperstone GmbHZetex PlcSensoNor ASALightwave Logic, Inc.Standing Egg, Inc.Antares Advanced Test Technologies (Suzhou) Co., Ltd.Antares Advanced Test Technologies (Suzhou) Co., Ltd.California Micro Devices Corp.MC Technology Co., Ltd.Silicon Inside Co., Ltd.MC Technology Co., Ltd.Color Chip (Israel) Ltd.Biorem, Inc.NEC Electronics America, Inc.EstiNet Technologies, Inc.AerNos, Inc.BIOCAM GmbH
Taiwan Semiconductor Manufacturing Co., Ltd.Shin-Etsu Chemical Co., Ltd.Shin-Etsu Handotai Co., Ltd.Angang Steel Co., Ltd.Wuhan Iron & Steel Co., Ltd.Soitec SAWuhan Iron & Steel Group Corp.Fujimi, Inc.Elpida Memory, Inc.Siltronic AGPrimetals Technologies Austria GmbHElkem ASAElectro Scientific Industries, Inc.AIXTRON SENippon Steel & Sumikin Coated Sheet Corp.Inner Mongolia Baotou Steel Union Co. Ltd.Hirata Corp.LX Semicon Co., Ltd.CSG Holding Co., Ltd.GlobalWafers Co., Ltd.eMemory Technology, Inc.Silicon Integrated Systems Corp.Silicon Integrated Systems Corp.Faraday Technology Corp.OSAKA Titanium Technologies Co., Ltd.GigaLane Co., Ltd.Anshan Iron & Steel Group Corp.Fujikoshi Machinery Corp.Tongwei Co., Ltd.Institut National des Sciences Appliquées de Lyon
Canon, Inc.Ricoh Co., Ltd.Ricoh Co., Ltd.Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Casio Computer Co., Ltd.Fraunhofer-Gesellschaft eVOlympus Corp.Hamamatsu Photonics KKKoito Manufacturing Co., Ltd.Minolta Co., Ltd.OSRAM Opto Semiconductors GmbHNichia Corp.JSWKennametal, Inc.Hisense Visual Technology Co., Ltd.Polyplastics Co., Ltd.Lite-On Technology Corp.Han's Laser Technology Industry Group Co., Ltd.Han's Laser Technology Industry Group Co., Ltd.Optoma Corp.Waymo LLCCanon Marketing Japan, Inc.Shibuya Corp.Gwangju Institute of Science & TechnologyKEYENCE Corp.Leica Geosystems AGShandong Normal UniversityMKS Instruments, Inc.Appotronics Corp. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
