ShopifyRedditTik tokAppleSquarespaceSoundcloudMediumParallelsZoomGoogleGodaddyMicrosoftForbesEtsyHuawei TechnologiesYandexAmazonEvent briteDribbbleHatenaWalmartWPengineUberSplunkServiceNowTwilioHubSpotMuleSoftBloombergCargill
Nihon Dempa Kogyo Co., Ltd.Miyazaki Epson Corp.Nihon Plast Co., Ltd.CTS Corp.Daishinku Corp.Exelis, Inc.Sejung Co., Ltd.Montaplast GmbHSiTime Corp.Piezotech LLCTXC Corp.Midé Technology Corp.RIVER ELETEC CORP.École Nationale Supérieure de Mécanique et des MicrotechniqueInterquip Electronic Shenzhen Co. Ltd.Anjie Wireless Technology (Suzhou) Co., Ltd.Channel Products, Inc.Vectron International, Inc.PI Ceramic GmbHUmfotec GmbHCTS Ceramics Denmark A/SVesper Technologies, Inc.Chengdu Kingbri Frequency Technology Co. Ltd.Siward Crystal Technology Co., Ltd.Guangdong Failong Crystal Technology Co., LtdSawtek, Inc.Knowles Cazenovia, Inc.QorTek, Inc.Cedrat Technologies SAOxsensis Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Sony Group Corp.LG Electronics, Inc.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Konica Minolta, Inc.
LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Toshiba Chemical Corp.Kyocera Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.Electronics & Telecommunications Research InstituteMita Industrial Co., Ltd.The Dow Chemical Co.Guangzhou Bosma Optoelectronic Technology Co. Ltd.
Electronics & Telecommunications Research InstituteYamaha Corp.JVCKenwood Corp.Semiconductor Components Industries LLCAlpine Electronics, Inc.Japan Radio Co. Ltd.Skyworks Solutions, Inc.Harman International Industries, Inc.Rohde & Schwarz GmbH & Co. KGJOLED, Inc.Primax Electronics Ltd.Toshiba Electronic Devices & Storage Corp.Onkyo Home Entertainment Corp.Cirrus Logic, Inc.AVIC Jonhon Optronic Technology Co., Ltd.AVIC Jonhon Optronic Technology Co., Ltd.Heraeus Precious Metals GmbH & Co. KGSonos, Inc.GTE Sylvania, Inc.GTE Sylvania, Inc.STMicroelectronics International NVNuvoton Technology Corp.DX Antenna Co., Ltd.Bang & Olufsen A/SShenzhen Topband Co., Ltd.PPC Broadband, Inc.Shenzhen Sunway Communication Co., Ltd.Shenzhen Sunway Communication Co., Ltd.Shenzhen H&T Intelligent Control Co., Ltd.MACOM Technology Solutions Holdings, Inc.
OSRAM Opto Semiconductors GmbHFreescale Semiconductor, Inc.Dr. Johannes Heidenhain GmbHHarman International Industries, Inc.Takata, Inc.TEAC Corp.Nihon Dempa Kogyo Co., Ltd.Keihin Corp.Asahi Kasei Microdevices Corp.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.Yamato-Scale Co., Ltd.Key Safety Systems, Inc.CTS Corp.VACUUMSCHMELZE GmbH & Co. KGWatlow Electric Manufacturing Co.Roche Diabetes Care GmbHWatlow Electric Manufacturing Co.Draeger Safety, Inc.Analogic Corp.Preh GmbHPepperl+Fuchs, Inc.Methode Electronics, Inc.Kistler Holding AGExelis, Inc.Shoei Chemical, Inc.BorgWarner Ludwigsburg GmbHInterface, Inc.FIGARO Engineering, Inc.Sensirion AG
General Electric Co.General Electric Co.DENSO Corp.Honeywell International, Inc.Schaeffler Technologies AG & Co. KGFANUC Corp.Yokogawa Electric Corp.Azbil Corp.Hitachi Industrial Equipment Systems Co., Ltd.Rohde & Schwarz GmbH & Co. KGHochiki Corp.Legrand SARittal GmbH & Co. KGZhejiang Chint Electrics Co., Ltd.JFE Engineering Corp.Aiphone Co., Ltd.Leica Geosystems AGLeica Geosystems AGIDEC Corp.Allen-Bradley Co., Inc.Castrol Ltd.Schweitzer Engineering Laboratories, Inc.Panasonic Industrial Devices SUNX Co., Ltd.Panasonic Industrial Devices SUNX Co., Ltd.Schneider Electric SETamron Co., Ltd.Keysight Technologies, Inc.Hokuriku Electric Industry Co., Ltd.Hokuriku Electric Industry Co., Ltd.Pilz GmbH & Co. KG
Boe Innovation Investment Co. Ltd.Honeywell International, Inc.Thales GroupAlps Alpine Co., Ltd.Raytheon Co.NGK SPARK PLUG CO., LTD.Hamamatsu Photonics KKRaytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.OSRAM Opto Semiconductors GmbHNippon Seiki Co., Ltd.LAPIS Semiconductor Co. Ltd.HELLA GmbH & Co. KGaAAnalog Devices, Inc.DePuy Synthes Products, Inc.Rosemount, Inc.Dr. Johannes Heidenhain GmbHThe Georgia Tech Research Corp.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Furuno Electric Co., Ltd.Novatek Microelectronics Corp.Asahi Kasei Microdevices Corp.Meizu Technology Co. Ltd.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.KEYENCE Corp.Weidmüller Interface GmbH & Co. KGPiaggio & C SpAB/E Aerospace, Inc.
