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Shimano, Inc.NIKE, Inc.AMF, Inc.Acushnet Co.Topgolf Callaway Brands Corp.Bridgestone Sports Co., Ltd.Adam Opel GmbHMizuno Corp.SRI Sports Ltd.ASICS Corp.PUMA SEOakley, Inc.ZENOAH, Inc.CATEYE Co., Ltd.Skis Rossignol SASYETI Coolers LLCTaylor Made Golf Co., Inc.AMF, Inc.Shikoku System ProductSRAM LLCReebok International Ltd.Remington Arms Co. LLCWilson Sporting Goods Co.Hexcel Corp.Molten Corp.Yamamoto Kogaku Co. Ltd.Polar Electro OyGiant Manufacturing Co., Ltd.Zhejiang Dafeng Industry Co., Ltd.Parsons Xtreme Golf LLC
Toyota Motor Corp.Huawei Technologies Co., Ltd.Apple, Inc.OppoNTT DOCOMO, Inc.Fujikura Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.KDDI Corp.China United Network Communications Ltd.Motorola Mobility LLCNintendo Co., Ltd.Motorola Solutions Credit Co. LLCOrange SAGoerTek Inc.Deutsche Telekom AGChina Telecom Corp. Ltd.Toyo Ink SC Holdings Co. Ltd.Giesecke+Devrient GmbHWalmart LabsLear Corp.Skyworks Solutions, Inc.Chunghwa Picture Tubes Ltd.Nanya Technology Corp.Shenzhen Royole Technologies Co., Ltd.LG Uplus Corp.Meizu Technology Co. Ltd.Snap, Inc.Bull SA
Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.Apple, Inc.ZTE Corp.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Motorola, Inc.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.
General Time Corp.Fujian Reida Precision Co., Ltd.QST Corp.QST Corp.Fossil Group, Inc.Integrated Display Technology LLC
Renesas Electronics Corp.Semiconductor Components Industries LLCMarvell Asia Pte Ltd.Freescale Semiconductor, Inc.LAPIS Semiconductor Co. Ltd.Analog Devices, Inc.Fujitsu Semiconductor Ltd.Atmel Corp.Novatek Microelectronics Corp.Novuton Technology Corp. JapanYamaichi Electronics Co., Ltd.MegaChips Corp.STMicroelectronics International NVSilicon Storage Technology, Inc.Silicon Motion Technology Corp.Nuvoton Technology Corp.EM Microelectronic-Marin SAELAN Microelectronics Corp.Spansion Inc.Micronas GmbHeMemory Technology, Inc.Nordic Semiconductor ASASANYO Semiconductor Co., Ltd.Samtec, Inc.Samtec, Inc.Dialog Semiconductor (UK) Ltd.Alpha & Omega Semiconductor Ltd.Holtek Semiconductor, Inc.Chipsea Technologies (Shenzhen) Corp., Ltd.BitMain Technologies Holding Co.
TIBCO Software, Inc.Tervela, Inc.Urovo Technology Co., Ltd.Profusa, Inc.Domo, Inc.AmalQuantcast Corp.Digital Fountain, Inc.Shanghai Information2 Software, Inc.Shanghai Information2 Software Inc.GridPoint, Inc.Eccrine Systems, Inc.Fybr LLCWorkiva, Inc.PCS Ferguson, Inc.Wattbike Ltd.Aclima, Inc.Pillar Vision, Inc.Nectar, Inc.Guangzhou Huawei Software Co., Ltd.Wireless Seismic, Inc.OSIsoft LLCPatrocinium Systems, Inc.Sensire OyDundas Data Visualization, Inc.iOpener Media GmbHClause, Inc.Acta Technology, Inc.AMAC, Inc.Grey Orange Pte Ltd.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.
