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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
Samsung Electronics Co., Ltd.Micron Technology, Inc.MagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Gentex Corp.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.Unity Opto Technology Co., Ltd.Rockley Photonics Ltd.IHP GmbH - Innovations for High Performance MicroelectronicsInvensas Bonding Technologies, Inc.National Chi Nan UniversityFoveon, Inc.MOBOTIX AGAvnera Corp.Tung Thih Electronic Co., Ltd.Skorpios Technologies, Inc.Lightmatter, Inc.Brigates Microelectronics Inc.Tower Semiconductor Ltd.Pixelplus Co., Ltd.AmberWave Systems Corp.MEMSIC, Inc.Sofics BVBASilicon Optronics, Inc.Insiava Pty Ltd.Xiroku, Inc.New Imaging Technologies SADecaWave Ltd.Luxtera, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
MagnaChip Semiconductor Ltd.SANYO Semiconductor Co., Ltd.Allwinner Technology Co., Ltd.cynora GmbHPixtronix, Inc.Invensas Bonding Technologies, Inc.Shanghai Ciyu Information Technologies Co., Ltd.Candescent Technologies Corp.Lightmatter, Inc.SRC Computers LLCPixTech, Inc.Easylinkin Technology Co. Ltd.Hangzhou Star Shuaier Electric Appliance Co., Ltd.Hangzhou Star Shuaier Electric Appliance Co., Ltd.Feature Integration Technology Inc.Feature Integration Technology Inc.AmberWave Systems Corp.Anvil TechnologyLinear Labs, Inc.Uhnder, Inc.Transmeta Corp.QD Vision, Inc.Clairvoyante, Inc.Newport Media, Inc.Shanghai Shenxiling Micro-electronics Technology Co. Ltd.Hycon Technology Corp.Bodle Technologies Ltd.Korea Electric Power Industrial Development Co., Ltd.Neurala, Inc.Leadis Technology, Inc.
Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.China Telecom Corp. Ltd.