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Ericsson, Inc.Nippon Telegraph & Telephone Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.BT Group PlcChina Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.China Telecom Corp. Ltd.Xilinx, Inc.Broadcom Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
Alps Alpine Co., Ltd.OSRAM Opto Semiconductors GmbHRosemount, Inc.Dr. Johannes Heidenhain GmbHKeihin Corp.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.Key Safety Systems, Inc.Watlow Electric Manufacturing Co.Watlow Electric Manufacturing Co.Draeger Safety, Inc.The Toro Co.InvenSense, Inc.ifm electronic GmbHPreh GmbHPepperl+Fuchs, Inc.Methode Electronics, Inc.BorgWarner Ludwigsburg GmbHInterface, Inc.Casco Products Corp.FIGARO Engineering, Inc.Nippon Ceramic Co., Ltd.Balluff, Inc.Hanwei Electronics Group Corp.PolyIC GmbH & Co. KGTokico System Solutions Ltd.IDEX Biometrics ASAElmos Semiconductor SENippon Aleph Corp.Nova Biomedical Corp.
Sharp Corp.Alps Alpine Co., Ltd.Hamamatsu Photonics KKSony Semiconductor Solutions Corp.OSRAM Opto Semiconductors GmbHSemiconductor Components Industries LLCRosemount, Inc.Dr. Johannes Heidenhain GmbHShenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Takata, Inc.Novatek Microelectronics Corp.Keihin Corp.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.Key Safety Systems, Inc.STMicroelectronics International NVWatlow Electric Manufacturing Co.Watlow Electric Manufacturing Co.Draeger Safety, Inc.ELAN Microelectronics Corp.ifm electronic GmbHPreh GmbHCrucialtec Co., Ltd.Pepperl+Fuchs, Inc.Egis Technology, Inc.Methode Electronics, Inc.BorgWarner Ludwigsburg GmbHInterface, Inc.Casco Products Corp.
OSRAM Opto Semiconductors GmbHFreescale Semiconductor, Inc.Rosemount, Inc.Dr. Johannes Heidenhain GmbHHarman International Industries, Inc.Takata, Inc.TEAC Corp.Nihon Dempa Kogyo Co., Ltd.Keihin Corp.Asahi Kasei Microdevices Corp.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.Yamato-Scale Co., Ltd.Key Safety Systems, Inc.CTS Corp.VACUUMSCHMELZE GmbH & Co. KGWatlow Electric Manufacturing Co.Roche Diabetes Care GmbHWatlow Electric Manufacturing Co.Draeger Safety, Inc.ifm electronic GmbHAnalogic Corp.Preh GmbHPepperl+Fuchs, Inc.Methode Electronics, Inc.Kistler Holding AGExelis, Inc.Shoei Chemical, Inc.BorgWarner Ludwigsburg GmbHInterface, Inc.
Alps Alpine Co., Ltd.NGK SPARK PLUG CO., LTD.OSRAM Opto Semiconductors GmbHFreescale Semiconductor, Inc.Analog Devices, Inc.DePuy Synthes Products, Inc.Keihin Corp.Asahi Kasei Microdevices Corp.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.Vega Grieshaber KGKey Safety Systems, Inc.CTS Corp.STMicroelectronics International NVWatlow Electric Manufacturing Co.Watlow Electric Manufacturing Co.Draeger Safety, Inc.Given Imaging Ltd.Preh GmbHHoriba Stec Co. Ltd.Methode Electronics, Inc.Kistler Holding AGBorgWarner Ludwigsburg GmbHOVAL Corp.Nagano Keiki Co., Ltd.Interface, Inc.Casco Products Corp.FlexEnable Ltd.Shenzhen Suteng Innovation Technology Co., Ltd.FIGARO Engineering, Inc.
Boe Innovation Investment Co. Ltd.Honeywell International, Inc.Thales GroupAlps Alpine Co., Ltd.Raytheon Co.NGK SPARK PLUG CO., LTD.Hamamatsu Photonics KKRaytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.OSRAM Opto Semiconductors GmbHNippon Seiki Co., Ltd.Freescale Semiconductor, Inc.LAPIS Semiconductor Co. Ltd.HELLA GmbH & Co. KGaAAnalog Devices, Inc.DePuy Synthes Products, Inc.Rosemount, Inc.Dr. Johannes Heidenhain GmbHThe Georgia Tech Research Corp.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Furuno Electric Co., Ltd.Novatek Microelectronics Corp.Textron, Inc.Asahi Kasei Microdevices Corp.Meizu Technology Co. Ltd.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.KEYENCE Corp.Weidmüller Interface GmbH & Co. KG