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DENSO Corp.KYOCERA Chemical Corp.DAIKIN INDUSTRIES Ltd.Electronics & Telecommunications Research InstituteABB Automation, Inc.Yamaha Corp.FANUC Corp.Fujitsu General Ltd.ABB Automation, Inc.Muratec Automation Co., Ltd.Yokogawa Electric Corp.Harbin Institute of TechnologyASML Netherlands BVYASKAWA Electric Corp.USM Ltd.Qingdao Haier Air Conditioner Co., Ltd.Azbil Corp.Babcock Hitachi KKAlliedSignal, Inc.Hitachi Appliances, Inc.NEC Platforms Ltd.Maschinenfabrik Rieter AGHarris Intertype Corp.Sophia Co. Ltd.Sophia Co. Ltd.Qingdao Haier Washing Machine Co., Ltd.SEMES Co., Ltd.Qingdao Haier Air Conditioning Electronics Co., Ltd.Qingdao Haier Washing Machine Co., Ltd.Analog Devices, Inc.
International Business Machines Corp.McNeil-PPC, Inc.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Shanghai Feixun Communication Co., LtdShanghai Feixun Communication Co., LtdLeica Geosystems AGLeica Geosystems AGSoftBank Corp.Genesys Cloud Services, Inc.Planmeca OyYealink Network Technology Corp. Ltd.Yonyou Network Technology Co., Ltd.IGNIS Innovation, Inc.Hyperion Catalysis International, Inc.Avaya-Tenovis GmbH & Co. KGInguran LLCVibram SpAHirschmann Car Communication GmbHINVENT Umwelt- und Verfahrenstechnik AGIconex LLCSiebel Systems, Inc.SweTree Technologies ABPSS Belgium NVCareland, Inc.GTC Technology US LLCParmigiani Fleurier SACanadian Blood ServicesMMM Münchener Medizin Mechanik GmbHAsiainfo Technologies (China) Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.
Toyota Motor Corp.Seiko Epson Corp.Honda Motor Co., Ltd.DENSO Corp.Midea Group Co. Ltd.Yamaha Motor Co., Ltd.FANUC Corp.Iseki & Co., Ltd.Hilti AGYASKAWA Electric Corp.SZ DJI Technology Co., Ltd.DAEWOO SHIPBUILDING & MARINE ENGINEERING Co., Ltd.NVIDIA Corp.JD.com, Inc.Miele & Cie. KGDana-Farber Cancer Institute, Inc.Mattel, Inc.Husqvarna ABLEGO A/SHaldor Topse A/SLEGO A/SNational Aeronautics & Space AdministrationThe Shenzhen Institutes of Advanced TechnologyThe Shenzhen Institutes of Advanced TechnologyWaymo LLCRyobi Ltd.Shibuya Corp.Tatsuno Corp.Nachi-Fujikoshi Corp.Bozhon Precision Industry Technology Co., Ltd.
General Electric Co.General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.SNECMA SARaytheon Co.Subaru Corp.Beihang UniversityLucas Industries PlcDaicel Corp.KYB Corp.Hughes Aircraft Co.Airbus Operations Ltd.SZ DJI Technology Co., Ltd.Raytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.Hamilton Sundstrand Corp.AlliedSignal, Inc.Eclipse Aviation Corp.Tektronix, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.United Aircraft Corp.Analog Devices, Inc.Mitsubishi Cable Industries Ltd.Voith GmbH & Co. KGaAMesserschmitt-Boelkow-Blohm GmbHMesserschmitt-Boelkow-Blohm GmbHNorthrop Grumman Systems Corp.