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Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
KEYENCE Corp.Fluke Corp.Castrol Ltd.Nippon Avionics Co., Ltd.National Instruments Corp.PRÜFTECHNIK Dieter Busch AGPRÜFTECHNIK Dieter Busch AGSoftware AGOpex Corp.Software AGPTC, Inc.SmartSky Networks LLCOmron Microscan Systems, Inc.Basler AGWuhan Guide Infrared Co., Ltd.Computational Systems, Inc.Uptake Technologies, Inc.SPM Instrument ABBently Nevada, Inc.XJet Ltd.ISRA VISION AG /Old/Thermoteknix Systems Ltd.SPECTRO Analytical Instruments GmbHC3.ai, Inc.Ruiji-Greatec Oil & Gas Projects Co. Ltd.Baumer Optronic GmbHMVTec Software GmbHsteute Schaltgeräte GmbH & Co. KGRuiji-Greatec Oil & Gas Projects Co. Ltd.Beet, Inc.
Hewlett Packard Enterprise Development LPNational University of Defense TechnologyNational University of Defense TechnologyGoerTek Inc.Dongguan University of TechnologyShanghai Maritime UniversityXiamen University of TechnologyHebei University of Science & TechnologyNachi-Fujikoshi Corp.UBTECH Robotics Corp. Ltd.Zhejiang Gongshang UniversityCarnegie Mellon UniversitySoftBank Corp.Iflytek Co., Ltd.iRobot Corp.Lovely Professional UniversityKyushu Institute of TechnologyChandigarh UniversityNanchang Institute of TechnologyNational Kaohsiung University of Applied SciencesBeijing Minglue Software System Ltd.Beijing Minglue Software System Ltd.Osaka Prefecture UniversityFujifilm Dimatix, Inc.City University of Hong KongCity University of Hong KongAmyris, Inc.National Yunlin University of Science & TechnologyVysoká kola Bánská-Technická Univerzita OstravaCompugen Ltd.
Honeywell International, Inc.Mitsubishi Motors Corp.FANUC Corp.Toyota Industries Corp.Yokogawa Electric Corp.YASKAWA Electric Corp.Magic Leap, Inc.SRI InternationalPixArt Imaging, Inc.Nachi-Fujikoshi Corp.KEYENCE Corp.Denso Wave, Inc.Jungheinrich AGBaker Perkins Ltd.Nippon Avionics Co., Ltd.Reliance Electric Ltd.Dassault Systèmes SAM-System Co., Ltd.ifm electronic GmbHCognex Corp.Hypertherm Associates, Inc.Auris Health, Inc.The Raymond Corp.TECO Electric & Machinery Co., Ltd.Kehua Data Co., Ltd.Kollmorgen Corp.Hunan Chinasun Pharmaceutical Machinery Co., Ltd.TECO Electric & Machinery Co., Ltd.Hunan Chinasun Pharmaceutical Machinery Co., Ltd.Beckhoff Automation GmbH & Co. KG
Nippon Telegraph & Telephone Corp.Delphi Technology, Inc.ServiceNow, Inc.SAS Institute, Inc.D-Wave Systems, Inc.Bigfoot Biomedical, Inc.Fair Isaac Corp.Workday, Inc.Cray, Inc.MicroStrategy, Inc.Omnitracs LLCCoreLogic, Inc.[24]7.ai, Inc.TIBCO Software, Inc.Niantic, Inc.Tableau Software LLCNICE Systems, Inc.Comptel OyjOracle Corp.MagiQ Technologies, Inc.Teradata Corp.Fio Corp.Booz Allen Hamilton, Inc.Amper SAUptake Technologies, Inc.Altairnano, Inc.ID Quantique SAAGT International GmbHM Squared Lasers Ltd.SparkCognition, Inc.
Visual Process Ltd.
Schaeffler Technologies AG & Co. KGFluke Corp.Castrol Ltd.Nippon Avionics Co., Ltd.National Instruments Corp.PRÜFTECHNIK Dieter Busch AGPRÜFTECHNIK Dieter Busch AGSoftware AGOpex Corp.Software AGSKF USA, Inc.Burckhardt Compression AGMarquette UniversityFosbel, Inc.Bently Nevada, Inc.Woojin Electro-Nite, Inc.Perpetuum Ltd.Thermoteknix Systems Ltd.Omnisens SASPECTRO Analytical Instruments GmbHGainSpan Corp.Corrpro Cos., Inc.Beijing Bohua Xinzhi Technology, Inc.Dual Inventive Holding BVBrüel & Kjær Vibro GmbHBeijing Bohua Xinzhi Technology, Inc.Dynapar Corp.Seebo Interactive Ltd.Poseidon Nickel Ltd.KCF Technologies, Inc.