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Ricoh Co., Ltd.Ricoh Co., Ltd.Hewlett-Packard Development Co.Eastman Kodak Co.Dai Nippon Printing Co., Ltd.Konica Minolta, Inc.Koninklijke DSM NVMassachusetts Institute of TechnologyNGK SPARK PLUG CO., LTD.Saudi Arabian Oil Co.Mitsubishi Paper Mills Ltd.Kennametal, Inc.Unisys Corp.Tokyo Seimitsu Co., Ltd.Waymo LLCRenishaw PlcLenzing AGSMS group GmbHSandvik AktiebolagManroland Sheetfed GmbHMimaki Engineering Co., Ltd.Hoeganaes Corp.Align Technology, Inc.Draper, Inc.IDEC Corp.Greatbatch Ltd.Widex A/SWidex A/S3D Systems, Inc.Autodesk, Inc.
BlackBerry Ltd.Socionext, Inc.Macronix International Co., Ltd.Freescale Semiconductor, Inc.VIA Technologies, Inc.Unisys Corp.Broadcom Corp.Atmel Corp.British Gas Ltd.Shenzhen Polytechnic CollegeTYK Corp.Schweitzer Engineering Laboratories, Inc.Indesit Company SpANuvoton Technology Corp.Hitachi Industry & Control Solutions Ltd.Pilz GmbH & Co. KGHandan CollegeEVOC Intelligent Technology Co. Ltd.EVOC Intelligent Technology Co. Ltd.SCHUNK GmbH & Co. KGHoltek Semiconductor, Inc.Shanghai Huahong Integrated Circuit Co., Ltd.Shanghai Huahong Integrated Circuit Co., Ltd.Stefan cel Mare University of SuceavaBaumüller Nürnberg GmbHPTC, Inc.Coherent Logix, Inc.ATS Corp.Xicato, Inc.Dassault Systemes Simulia Corp.
Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Toray Industries, Inc.Toyobo Co., Ltd.Hitachi Cable Ltd.Eastman Chemical Co.IBIDEN Co., Ltd.Unitika Ltd.Zhejiang Sci-Tech UniversityKolon Industries, Inc.Chisso Corp.China Telecom Corp. Ltd.Nisshinbo Textile Inc.Xi'an Polytechnic UniversityTrützschler GmbH & Co. KGNikkiso Co., Ltd.Lenzing AGJNC Corp.ROCKWOOL A/SKurimoto Ltd.LG Information & Communications Ltd.Nichiha Corp.Buckman Laboratories International, Inc.KCC Corp.Beijing New Building Materials Public Ltd. Co.kabelmetal electro GmbHMERCURY Corp.Campagnolo SRLGE Lighting Solutions LLCLevel 3 Communications LLC
Hitachi Plant Technologies Ltd.Science & Technology Corp.Zhejiang Dun'an Artificial Environment Co., Ltd.DUCATI Energia SpAAlenia Aermacchi SpAGould Electronics, Inc.MicroUnity Systems Engineering, Inc.KPIT Technologies Ltd.Mitsubishi Space Software Co. Ltd.?cole de Technologie Sup?rieureBooz Allen Hamilton, Inc.Shenzhen Sunwin Intelligent Co., Ltd.L&T Technology Services Ltd.Richard Bergner Verbindungstechnik GmbH & Co. KGShenzhen Sunwin Intelligent Co., Ltd.Shanghai Jangho Curtain Wall System Engineering Co., Ltd.First Principles, Inc.Tangshan Jidong Equipment & Engineering Co., Ltd.Areté Associates, Inc.Shanghai Jangho Curtain Wall System Engineering Co., Ltd.Sunresin New Materials Co., Ltd.O.Me.R. SpAVivonics, Inc.Pontifícia Universidade Católica do Rio de JaneiroInnovative Concepts, Inc.Murtech, Inc.Jiangsu I-Front Science & Technology Co. Ltd.Sciperio, Inc.Navalimpianti SpAAdvanced Optical Technologies, Inc.
Toyota Motor Corp.Seiko Epson Corp.Honda Motor Co., Ltd.DENSO Corp.Midea Group Co. Ltd.FANUC Corp.Iseki & Co., Ltd.Hilti AGYASKAWA Electric Corp.SZ DJI Technology Co., Ltd.DAEWOO SHIPBUILDING & MARINE ENGINEERING Co., Ltd.NVIDIA Corp.JD.com, Inc.Miele & Cie. KGDana-Farber Cancer Institute, Inc.Mattel, Inc.Husqvarna ABLEGO A/SHaldor Topse A/SLEGO A/SNational Aeronautics & Space AdministrationThe Shenzhen Institutes of Advanced TechnologyQinetiQ Ltd.The Shenzhen Institutes of Advanced TechnologyWaymo LLCRenishaw PlcSRI InternationalRyobi Ltd.Shibuya Corp.Tatsuno Corp.