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TongFu Microelectronics Co., Ltd.Shanghai Dajiatian Electronic Manufacture Co. Ltd.LeFram Technology Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
JUKI Corp.Electro Scientific Industries, Inc.ChipMOS Technologies, Inc.Powertech Technology, Inc.JCET Group Co., Ltd.Mirae Corp.Koh Young Technology, Inc.Chipbond Technology Corp.ASM Assembly Systems GmbH & Co. KGKunshan Q Technology Co., Ltd.CyberOptics Corp.Shenzhen JT Automation Equipment Co., Ltd.Shenzhen JT Automation Equipment Co., Ltd.Shenzhen Colibri Technologies Co., Ltd.Shenzhen Colibri Technologies Co., Ltd.Guangdong Champion Asia Electronics Co., Ltd.Zhejiang Jiemei Electronic & Technology Co., Ltd.Japan Unix Co. Ltd.Key Tronic Corp.Aurotek Corp.E&R Engineering Corp.Pillarhouse International Ltd.KX Hitech Co., Ltd.Laser Tek Taiwan Co., Ltd.Allen Organ Company LLCUltra-Pak Industries Co. Ltd.Advantek, Inc.Kostat, Inc.Shanghai Dajiatian Electronic Manufacture Co. Ltd.ASM Assembly Systems Weymouth Ltd.