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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVAGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.
Xerox Holdings Corp.Toshiba Tec Corp.XeroxAvery Dennison Corp.Miyazaki Epson Corp.Zenith Electronics LLCSymbol Technologies, Inc.Spectrum Brands, Inc.TomTom International BVPHC Holdings Corp.Miwa Lock Co., Ltd.Star Micronics Co., Ltd.Shandong New Beiyang Information Technology Co., Ltd.Zebra Technologies Corp.Shandong New Beiyang Information Technology Co., Ltd.Siemens AG ÖsterreichSensormatic Electronics LLCProMOS Technologies, Inc.Indesit Company SpAEM Microelectronic-Marin SAKYOCERA AVX Components Corp.Harada Industry Co., Ltd.pSemi Corp.Marchesini Group SpABinder GmbHLeica Biosystems Nussloch GmbHKESPION Co., Ltd.Shenzhen Genvict Technologies Co., Ltd.LitePoint Corp.Macdermid Enthone, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.
Golden Bridge Electech Inc.Securitag Assembly Group Co., Ltd.Technische Hochschule KoelnChris-Craft Industries, Inc.Scirocco AB
Laopu Gold Co., Ltd.Melzer Maschinenbau GmbHShanghai Inlay Link Inc.Shang Yang Rfid Technology Yangzhou Co., Ltd.Mutual-Pak Technology Co., Ltd.AmaTech Group Ltd.Securitag Assembly Group Co., Ltd.Livit BVShenzhen Bailide Jewelry Co., Ltd.Paragon ID SATagStar Systems GmbHCyrtina Dental Group BVJinco Universal Co., Ltd.Smallbone Plc
Daihatsu Motor Co., Ltd.JD.com, Inc.Industrial & Commercial Bank of China Ltd.Bank of America Corp.Industrial & Commercial Bank of China Ltd.Giesecke+Devrient GmbHVIA Technologies, Inc.SK Planet Co., Ltd.PayPal, Inc.Adam Opel GmbHNAVER Corp.Rakuten Group, Inc.Uber Technologies, Inc.Agricultural Bank of China Ltd.Target Corp.TendyRon Corp.Agricultural Bank of ChinaWONIK IPS CO., LTD.First Data Corp.Airbnb, Inc.Nations Technologies, Inc.Block, Inc.Lyft, Inc.Starbucks Corp.Groupon, Inc.Cashway Fintech Co., Ltd.Thales DIS France SAIndustrial Bank of KoreaCEC Huada Electronic Design Co., Ltd.FeliCa Networks, Inc.
Samsung Electronics Co., Ltd.Sony Group Corp.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.