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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.
KEYENCE Corp.ifm electronic GmbHLeuze electronic GmbH + Co. KGPepperl+Fuchs, Inc.Bernstein AGBanner Engineering Corp.Senba Sensing Technology Co. Ltd.Shenzhen Lingming Photon Technology Co. Ltd.Datasensor SpASensoPart Industriesensorik GmbHOPTEX FA Co., Ltd.Contrinex AGShanghai Xinggong Microelectronics Co. Ltd.
Fraunhofer-Gesellschaft eVFujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.SNECMA SAHamamatsu Photonics KKChina University of Petroleum (East China)China University of Petroleum (East China)OSRAM Opto Semiconductors GmbHSWCC Showa Holdings Co., Ltd.Seoul Viosys Co., Ltd.HIROSE ELECTRIC CO., LTD.Tamura Corp.Lawrence Livermore National LaboratoryCiena Corp.De la Rue International Ltd.MKS Instruments, Inc.Tatsuta Electric Wire & Cable Co., Ltd.Tatsuta Electric Wire & Cable Co., Ltd.iconectiv LLCHisense Broadband Multimedia Technologies Co., Ltd.Hisense Broadband Multimedia Technologies Co., Ltd.NTT Electronics Corp.Finisar Corp.Finisar Corp.MPI Corp.Lumentum Operations LLCMellanox Technologies Ltd.OFS Fitel LLCPreformed Line Products Co.