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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.
JUKI Corp.Shin-Etsu Polymer Co., Ltd.Electro Scientific Industries, Inc.Powertech Technology, Inc.JCET Group Co., Ltd.Mirae Corp.Koh Young Technology, Inc.Chipbond Technology Corp.ASM Assembly Systems GmbH & Co. KGKunshan Q Technology Co., Ltd.Universal Instruments Corp.Shenzhen JT Automation Equipment Co., Ltd.Shenzhen JT Automation Equipment Co., Ltd.Shenzhen Colibri Technologies Co., Ltd.Shenzhen Colibri Technologies Co., Ltd.Guangdong Champion Asia Electronics Co., Ltd.Zhejiang Jiemei Electronic & Technology Co., Ltd.Japan Unix Co. Ltd.Key Tronic Corp.Aurotek Corp.E&R Engineering Corp.Pillarhouse International Ltd.KX Hitech Co., Ltd.Laser Tek Taiwan Co., Ltd.Allen Organ Company LLCUltra-Pak Industries Co. Ltd.Advantek, Inc.Kostat, Inc.Shanghai Dajiatian Electronic Manufacture Co. Ltd.Shanghai Dajiatian Electronic Manufacture Co. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.
Daimler-Benz Aerospace AGFried. Krupp GmbHGebrueder SulzerNippon Steel Nisshin Co., Ltd.Koenig & Bauer AGKoenig & Bauer AGTaiheiyo Cement Corp.Snamprogetti SpAKennametal, Inc.China Construction Eighth Engineering Division Corp. Ltd.China Construction Second Engineering Bureau Co., Ltd.United States Gypsum Co.China Railway Siyuan Survey & Design Group Co., Ltd.United States Gypsum Co.Combustion Engineering, Inc.Primetals Asset Management U.K. Ltd.Saint-Gobain TM KKZhejiang Yasha Decoration Co., Ltd.Albemarle Corp.Johns Manville Corp.Powerchina Huadong Engineering Corp. Ltd.Powerchina Huadong Engineering Corp. Ltd.Shanghai Baoye Group Co., Ltd.Graco, Inc.China Construction Seventh Engineering Division Corp. Ltd.SMS group GmbHAhlstrom Machinery Corp.Korea Institute of Construction TechnologyThe First Co. of China Eighth Engineering Bureau Ltd.RHI Magnesita Deutschland AG
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.Electronics & Telecommunications Research Institute