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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
American Can Co.American Can Co.Toyo Seikan Group Holdings Ltd.Shinko Electric Industries Co., Ltd.Owens-Brockway Glass Container, Inc.Graphic Packaging International LLCShibuya Corp.Daiwa Can Co., Ltd.CROWN Packaging Technology, Inc.Riverwood International Corp.Mauser-Werke GmbHMeadWestvaco Corp.National Plastic Co., Ltd.FP Corp.Fuji Seal International, Inc.Henan Luohe Shineway Industry Group Co., Ltd.Plastipak Packaging, Inc.Yonwoo Co., Ltd.Hosokawa Yoko Co. Ltd.Saint-Gobain Glass France SASMauser Corp.Ranpak Corp.Precision Valve Corp.Mitsui Chemicals Tohcello, Inc.Ishizuka Glass (UK) Ltd.ALPLA Werke Alwin Lehner GmbH & Co. KGAppleton Papers, Inc.ADAMA Makhteshim Ltd.Toyo Glass Co., Ltd.Rengo Co., Ltd.
DENSO Corp.KYOCERA Chemical Corp.Taiwan Semiconductor Manufacturing Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Showa Denko Materials Co. Ltd.Resonac Corp.South China University of TechnologyEbara Corp.SCREEN Holdings Co., Ltd.University of Electronic Science & Technology of ChinaAdvanced Micro Devices, Inc.Lam Research Corp.Hangzhou Dianzi UniversitySemiconductor Components Industries LLCULVAC, Inc.JUKI Corp.Macronix International Co., Ltd.Shin-Etsu Handotai Co., Ltd.SEMES Co., Ltd.LAPIS Semiconductor Co. Ltd.Shinko Electric Industries Co., Ltd.Fujitsu Semiconductor Ltd.DB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.Skyworks Solutions, Inc.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.SMK Corp.Soitec SA
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.
Semiconductor Components Industries LLCSEMES Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Polaris Innovations Ltd.Siliconware Precision Industries Co., Ltd.Qimonda AGPowertech Technology, Inc.JCET Group Co., Ltd.AT & S Austria Technologie & Systemtechnik AGXintec, Inc.Amkor Technology, Inc.NEPES Corp.HANA MICRON, Inc.Camtek Ltd.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Seoul National UniversityTrust Alliance Information Development Inc., Ltd. ShanghaiFlipChip International LLCADL Engineering, Inc.Deca Technologies, Inc.Tera Probe, Inc.CONNECTEC JAPAN Corp.Palomar Technologies, Inc.Macrotech Technology, Inc.Macrotech Technology, Inc.Murata Electronics North America, Inc.GE Embedded Electronics Oy
Taiwan Semiconductor Manufacturing Co., Ltd.SEMES Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Tokyo Seimitsu Co., Ltd.Siliconware Precision Industries Co., Ltd.MKS Instruments, Inc.STATS ChipPAC Pte Ltd.FormFactor, Inc.ChipMOS Technologies, Inc.MPI Corp.Powertech Technology, Inc.JCET Group Co., Ltd.Namics Corp.AT & S Austria Technologie & Systemtechnik AGXintec, Inc.JAPAN ELECTRONIC MATERIALS CORP.JAPAN ELECTRONIC MATERIALS CORP.King Yuan Electronics Co., Ltd.Chipbond Technology Corp.Amkor Technology, Inc.NEPES Corp.Walton Advanced Engineering, Inc.Subtron Technology Co., Ltd.Foshan Nationstar Semiconductor Co., Ltd.Lingsen Precision Industries Ltd.Kinsus Interconnect Technology Corp.FINETECH GmbH & Co. KG3D Plus SASTianshui Huatian Technology Co., Ltd.
Shinko Electric Industries Co., Ltd.I-Chiun Precision Industry Co., Ltd.Dalian Golden Sanwei Technology Co. Ltd.Jentech Precision Industrial Co. Ltd.Youngyiel Precision Co., Ltd.Die-Tech, Inc.