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Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.China Telecom Corp. Ltd.
LG Electronics, Inc.Sharp Corp.Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Electronics & Telecommunications Research InstituteAlcatel-Lucent S ANTT DOCOMO, Inc.Showa Denko Materials Co. Ltd.Western Electric Co., Inc.Fujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyLucent Technologies, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Motorola Solutions, Inc.Tokyo Electric Power Co. Holdings, Inc.Nubia Technology Co., Ltd.Sony Ericsson Mobile Communications AB
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.
China United Network Communications Ltd.ADC Telecommunications, Inc.KATHREIN-Werke KGShenzhen Gongjin Electronics Co., Ltd.MaxLinear, Inc.Shenzhen Gongjin Electronics Co., Ltd.Charter Communications Operating LLCCox Communications, Inc.BCE, Inc.TQ Delta LLCNext Level Communications, Inc.Calix, Inc.PCT International, Inc.TriQuint WJ, Inc.Glowlink Communications Technology, Inc.Zinwell Corp.Teledyne Signal Processing Devices Sweden ABTeraSpan Networks, Inc.PCT Broadband Communication (Yantai)PCT Broadband Communication (Yantai)Société Européenne des Satellites SASociété Européenne des Satellites SAAddvalue Technologies Ltd.Broadband Innovations, Inc.All.Space Networks Ltd.Planet Technology Corp.Telsey SpANorsat International, Inc.Comtrend Corp.Tii Technologies, Inc.
National Semiconductor Corp.Atmel Corp.AVIC Jonhon Optronic Technology Co., Ltd.AVIC Jonhon Optronic Technology Co., Ltd.Qorvo US, Inc.Novuton Technology Corp. JapanSilicon Storage Technology, Inc.KMW, Inc.Anhui Tatfook Technology Co., Ltd.Nations Technologies, Inc.Tongyu Communication, Inc.Tongding Interconnection Information Co., Ltd.MaxLinear, Inc.GigaLane Co., Ltd.PARTRON Co., Ltd.DEXIN Corp.RichWave Technology Corp.E-TEN Information Systems Co., Ltd.INPAQ Technology Co., Ltd.NEW POWER PLASMA Co., Ltd.RF360 Europe GmbHCognitive Systems Corp.EZconn Corp.Wuhan Fingu Electronic Technology Co., Ltd.Jiangsu Hengxin Technology Co., Ltd.Officine di Cartigliano SpAWuhan Fingu Electronic Technology Co., Ltd.Jiangsu Hengxin Technology Co., Ltd.Resonant, Inc.ISCO International, Inc.
Taiwan Semiconductor Manufacturing Co., Ltd.Shin-Etsu Chemical Co., Ltd.Shin-Etsu Handotai Co., Ltd.Angang Steel Co., Ltd.Wuhan Iron & Steel Co., Ltd.Soitec SAWuhan Iron & Steel Group Corp.Fujimi, Inc.Elpida Memory, Inc.Siltronic AGPrimetals Technologies Austria GmbHElkem ASAElectro Scientific Industries, Inc.AIXTRON SENippon Steel & Sumikin Coated Sheet Corp.Inner Mongolia Baotou Steel Union Co. Ltd.Hirata Corp.LX Semicon Co., Ltd.CSG Holding Co., Ltd.GlobalWafers Co., Ltd.eMemory Technology, Inc.Silicon Integrated Systems Corp.Silicon Integrated Systems Corp.Faraday Technology Corp.OSAKA Titanium Technologies Co., Ltd.GigaLane Co., Ltd.Anshan Iron & Steel Group Corp.Fujikoshi Machinery Corp.Tongwei Co., Ltd.Institut National des Sciences Appliquées de Lyon
