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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.Samsung Display Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Boe Innovation Investment Co. Ltd.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.LG Display Co., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Applied Materials, Inc.Micron Technology, Inc.Fraunhofer-Gesellschaft eVShin-Etsu Chemical Co., Ltd.TOPPAN Holdings, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd.Nordson Corp.Shinko Electric Industries Co., Ltd.Tokyo Seimitsu Co., Ltd.Micronics Japan Co., Ltd.STATS ChipPAC Pte Ltd.FormFactor, Inc.ChipMOS Technologies, Inc.MPI Corp.Powertech Technology, Inc.JCET Group Co., Ltd.Namics Corp.AT & S Austria Technologie & Systemtechnik AGXintec, Inc.JAPAN ELECTRONIC MATERIALS CORP.JAPAN ELECTRONIC MATERIALS CORP.HANMI Semiconductor Co., Ltd.King Yuan Electronics Co., Ltd.Chipbond Technology Corp.Amkor Technology, Inc.SL Vionics Co., Ltd.NEPES Corp.HANA MICRON, Inc.Walton Advanced Engineering, Inc.Subtron Technology Co., Ltd.Foshan Nationstar Semiconductor Co., Ltd.Lingsen Precision Industries Ltd.Kinsus Interconnect Technology Corp.Samsung Semiconductor, Inc.FINETECH GmbH & Co. KG
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.SK hynix, Inc.Gree Electric Appliances, Inc. of ZhuhaiBrother Industries, Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fuji Electronics Co., Ltd.LG Display Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.Samsung Display Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.LG Display Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Micron Technology, Inc.Shin-Etsu Chemical Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Showa Denko Materials Co. Ltd.Resonac Corp.STMicroelectronics SA
Taiwan Semiconductor Manufacturing Co., Ltd.Applied Materials, Inc.United Microelectronics Corp.Shinko Electric Industries Co., Ltd.Fujitsu Semiconductor Ltd.Qimonda AGSTATS ChipPAC Pte Ltd.Invensas Corp.ChipMOS Technologies, Inc.Powertech Technology, Inc.JCET Group Co., Ltd.AT & S Austria Technologie & Systemtechnik AGXintec, Inc.King Yuan Electronics Co., Ltd.Chipbond Technology Corp.Amkor Technology, Inc.NEPES Corp.Advanced Chip Engineering Technology, Inc.HANA MICRON, Inc.Camtek Ltd.Niko Semiconductor Co., Ltd.Samsung Semiconductor, Inc.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Micron Technology Taiwan, Inc.Trust Alliance Information Development Inc., Ltd. ShanghaiTrust Alliance Information Development Inc., Ltd. ShanghaiFlipChip International LLCMutual-Pak Technology Co., Ltd.
Hon Hai Precision Industry Co., Ltd.SK hynix, Inc.Taiwan Semiconductor Manufacturing Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Applied Materials, Inc.South China University of TechnologySoutheast UniversityEbara Corp.SCREEN Holdings Co., Ltd.University of Electronic Science & Technology of ChinaLam Research Corp.DISCO Corp.Sony Semiconductor Solutions Corp.United Microelectronics Corp.Stanley Electric Co., Ltd.ULVAC, Inc.Macronix International Co., Ltd.Socionext, Inc.TOKYO OHKA KOGYO CO., LTD.KLA Corp.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.National Semiconductor Corp.Fujitsu Semiconductor Ltd.Nanjing University of TechnologyWinbond Electronics Corp.Skyworks Solutions, Inc.DB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.Shenzhen Goodix Technology Co., Ltd.
DENSO Corp.SK hynix, Inc.Taiwan Semiconductor Manufacturing Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Applied Materials, Inc.Micron Technology, Inc.Renesas Electronics Corp.Showa Denko Materials Co. Ltd.South China University of TechnologyResonac Corp.Ebara Corp.SCREEN Holdings Co., Ltd.University of Electronic Science & Technology of ChinaAdvanced Micro Devices, Inc.Lam Research Corp.DISCO Corp.KIOXIA Corp.United Microelectronics Corp.Hangzhou Dianzi UniversitySemiconductor Components Industries LLCULVAC, Inc.JUKI Corp.Macronix International Co., Ltd.Shin-Etsu Handotai Co., Ltd.Realtek Semiconductor Corp.LAPIS Semiconductor Co. Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Microchip Technology, Inc.Fujitsu Semiconductor Ltd.