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Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
TRUSTEES OF THE UNIV OF PENNSYLVANIANintendo Co., Ltd.Deutsches Zentrum für Luft- und Raumfahrt e.V.Mattel, Inc.Magic Leap, Inc.LG H&H Co., Ltd.University of PittsburghNippon Sanso KKAVL List GmbHShanghai Maritime UniversityImmersion Corp.Huaiyin Institute of TechnologyGhent UniversityHitachi-GE Nuclear Energy Ltd.Sikorsky Aircraft Corp.Guangdong Polytechnic Normal UniversityUniversity of Kentucky Research FoundationSony Interactive Entertainment LLC3D Systems, Inc.Israel Aerospace Industries Ltd.Huangshan UniversityKorea University of Technology & EducationThe Ritsumeikan TrustChang Gung UniversityThe Board of Trustees of The University of AlabamaXi'an International UniversityBinder GmbHPontificia Universidad Católica de ChileThe Climate Corp.Universidade Estadual Paulista Júlio De Mesquita Filho Unesp
Agora Lab, Inc.Ieso Digital Health Ltd.This Technology, Inc.Moasis Global Corp.Ecrio, Inc.NextPlane, Inc.Streem, Inc.CaféX Communications, Inc.Capture Technologies LLCB Labs8604819 Canada, Inc.
LG Uplus Corp.AVIC Jonhon Optronic Technology Co., Ltd.AVIC Jonhon Optronic Technology Co., Ltd.Telekom Deutschland GmbHNations Technologies, Inc.Leuze electronic GmbH + Co. KGNiigata Seimitsu Co., Ltd.Avaya-Tenovis GmbH & Co. KGOsaki Electric Co., Ltd.Hirschmann Car Communication GmbHConductix-Wampfler GmbHMotorola Israel Ltd.Gennum Corp.Tesat Spacecom GmbH & Co. KGSoftbank Telecom Corp.China Mobile Group Hubei Co., Ltd.GlobespanVirata, Inc.China Academy of Aerospace Electronics TechnologyShanghai Sunray Technology Co., Ltd.Shanghai Sunray Technology Co., Ltd.Futurepath Technology (Shenzhen) Co., Ltd.Futurepath Technology (Shenzhen) Co., Ltd.Globalstar, Inc.Weihai Ploumeter Co., Ltd.Nanotron Technologies GmbHLISNR, Inc.Lucibel SAShenzhen Rayvision Technology Co., Ltd.j-fiber GmbHUANGEL Corp.
General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.LIG Nex1 Co., Ltd.Raytheon Co.Subaru Corp.Beihang UniversityLucas Industries PlcDaicel Corp.KYB Corp.Hughes Aircraft Co.SZ DJI Technology Co., Ltd.Raytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.Hamilton Sundstrand Corp.AlliedSignal, Inc.Eclipse Aviation Corp.Tektronix, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.United Aircraft Corp.Analog Devices, Inc.Mitsubishi Cable Industries Ltd.Voith GmbH & Co. KGaAMesserschmitt-Boelkow-Blohm GmbHMesserschmitt-Boelkow-Blohm GmbHNorthrop Grumman Systems Corp.Pratt & Whitney Canada Corp.Raychem Corp.