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Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
Fujitsu Semiconductor Ltd.DB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.Synopsys, Inc.X-FAB Semiconductor Foundries GmbHAmkor Technology, Inc.Empyrean Technology Co., Ltd.ANSYS, Inc.Aavid Thermalloy LLCZuken Ltd.Dolphin Intégration SAMarlow Industries, Inc.Magma Design Automation LLCComair Rotron, Inc.Pulsic Ltd.Jasper Design Automation, Inc.Cellixsoft Corp.Zipalog, Inc.Tellurex Corp.IOTA TechnologyHammond Power Solutions, Inc.Boyd Corp. (Woburn), Inc.Breker Verification Systems, Inc.Kooltronic, Inc.Daisy Systems Corp.Athena Design Systems, Inc.Valid Logic Systems, Inc.Sagantec Israel Ltd.Teklatech A/SCertess, Inc.
KLA Corp.FARO Technologies, Inc.Zygo Corp.OPTiM Corp.Smiths Detection-Watford Ltd.3Shape A/S3Shape A/SLiebherr-Aerospace Lindenberg GmbHPTC, Inc.Dassault Systemes Simulia Corp.Anritsu Infivis Co., Ltd.Bentley Systems, Inc.Magnaflux Corp.Photon Dynamics, Inc.UNISON Co., Ltd.Keithley Instruments LLCFORCE TechnologyShantou Institute of Ultrasonic Instruments Co. Ltd.K LASER Technology, Inc.Shantou Institute of Ultrasonic Instruments Co. Ltd.Nikon Metrology NVFoshan Shunde Everteam Industrial Co. Ltd.Amann Girrbach AGPerceptron, Inc.Proceq SANgee Ann PolytechnicMagnetic Analysis Corp.JENTEK Sensors, Inc.Institut Dr. Foerster GmbH & Co. KGPaR Systems, Inc.
Semiconductor Components Industries LLCShinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Polaris Innovations Ltd.Qimonda AGPowertech Technology, Inc.Xintec, Inc.NEPES Corp.HANA MICRON, Inc.Camtek Ltd.Subtron Technology Co., Ltd.Niko Semiconductor Co., Ltd.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Zuken Ltd.Shanghai Meadville Science & Technology Co., Ltd.Trust Alliance Information Development Inc., Ltd. ShanghaiShanghai Meadville Science & Technology Co., Ltd.Trust Alliance Information Development Inc., Ltd. ShanghaiFlipChip International LLCADL Engineering, Inc.Seoul National UniversityJ-Devices Corp.Conexant Systems LLCDeca Technologies, Inc.Shinkawa Electric Co., Ltd.Macrotech Technology, Inc.Macrotech Technology, Inc.Murata Electronics North America, Inc.
Redox, Inc.Deep Labs, Inc.Skyx Systems Corp.Balanced Media Technology LLCNestro Lufttechnik GmbH