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VIA Technologies, Inc.Canon Marketing Japan, Inc.Hitachi Advanced Digital, Inc.Neusoft Corp.Asahi Techno Co., Ltd.Hanwang Technology Co., Ltd.YGsoft Inc.Yonyou Network Technology Co., Ltd.Shanghai Baosight Software Co., Ltd.Glodon Co., Ltd.Shanghai Baosight Software Co., Ltd.Newland Digital Technology Co., Ltd.Beijing Ultrapower Software Co., Ltd.Hundsun Technologies, Inc.Henan Splendor Science & Technology Co., Ltd.Henan Splendor Science & Technology Co., Ltd.Adesto Technologies Corp.Beijing Watertek Information Technology Co., Ltd.Beijing Watertek Information Technology Co., Ltd.Goldpac Ltd.Innodisk Corp.Wisesoft Co., Ltd.Suzhou MedicalSystem Technology Co., Ltd.Wonders Information Co., Ltd.Surfilter Network Technology Co., Ltd.Surfilter Network Technology Co., Ltd.XMOS Ltd.Haystack Technologies, Inc.YLZ Information Technology Co., Ltd.YLZ Information Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
BlackBerry Ltd.Socionext, Inc.Macronix International Co., Ltd.Freescale Semiconductor, Inc.VIA Technologies, Inc.Unisys Corp.Broadcom Corp.Atmel Corp.British Gas Ltd.Shenzhen Polytechnic CollegeTYK Corp.Schweitzer Engineering Laboratories, Inc.Indesit Company SpANuvoton Technology Corp.Hitachi Industry & Control Solutions Ltd.Pilz GmbH & Co. KGHandan CollegeEVOC Intelligent Technology Co. Ltd.EVOC Intelligent Technology Co. Ltd.SCHUNK GmbH & Co. KGHoltek Semiconductor, Inc.SAGE Electrochromics, Inc.Shanghai Huahong Integrated Circuit Co., Ltd.Shanghai Huahong Integrated Circuit Co., Ltd.Stefan cel Mare University of SuceavaBaumüller Nürnberg GmbHPTC, Inc.Coherent Logix, Inc.ATS Corp.Leonardo MW Ltd.
Hitachi Plant Technologies Ltd.Roke Manor Research Ltd.A.P. Systems SRLBenninger AGDCA Design International Ltd.Siemens Corporate Research, Inc.Stevens Institute of TechnologyNSD Co., Ltd.Hundsun Technologies, Inc.Integran Technologies, Inc.Fujian Yongfu Power Engineering Co., Ltd.Fujian Yongfu Power Engineering Co., Ltd.Avast Software sroLinewell Software Co., Ltd.SEI YKCVIC Software Engineering Co. Ltd.Super Talent Technology Corp.Clarkson UniversityBeijing Tricolor Technology Co., Ltd.Kirisun Communications Co. Ltd.Kirisun Communications Co. Ltd.Beijing Tricolor Technology Co., Ltd.Advanced Engineering Solutions Ltd.Fujian Newland Software Engineering Co., Ltd.Sinodata Co., Ltd.Fujian Newland Software Engineering Co., Ltd.GE Energy Power Conversion GmbHPontifícia Universidade Católica do Rio de JaneiroInnovative Concepts, Inc.Hyperion, Inc.
Hitachi Ltd.LG Electronics, Inc.Toyota Motor Corp.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.ZTE Corp.Apple, Inc.Boe Innovation Investment Co. Ltd.Google LLCHoneywell International, Inc.Xerox Holdings Corp.Bayerische Motoren Werke AGAlcatel-Lucent S ANTT DOCOMO, Inc.Renesas Electronics Corp.Dow Global Technologies LLCMicrosoft Corp.Toshiba Lighting & Technology Corp.Toyoda Gosei Co., Ltd.Toshiba Lighting & Technology Corp.Hilti AGMediaTek, Inc.Aisin AW Co., Ltd.Boston Scientific Scimed, Inc.Advanced Micro Devices, Inc.Otis Elevator Co.