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Toyota Motor Corp.Seiko Epson Corp.Honda Motor Co., Ltd.DENSO Corp.Midea Group Co. Ltd.Yamaha Motor Co., Ltd.FANUC Corp.Iseki & Co., Ltd.YASKAWA Electric Corp.SZ DJI Technology Co., Ltd.JD.com, Inc.Miele & Cie. KGMattel, Inc.Husqvarna ABLEGO A/SLEGO A/SBando Chemical Industries Ltd.National Aeronautics & Space AdministrationThe Shenzhen Institutes of Advanced TechnologyThe Shenzhen Institutes of Advanced TechnologySRI InternationalShenyang Institute of AutomationShibuya Corp.Nitto Kohki Co., Ltd.Tatsuno Corp.Nachi-Fujikoshi Corp.Bozhon Precision Industry Technology Co., Ltd.Bozhon Precision Industry Technology Co., Ltd.KEYENCE Corp.Denso Wave, Inc.
Toyota Motor Corp.Seiko Epson Corp.Honda Motor Co., Ltd.DENSO Corp.Midea Group Co. Ltd.Yamaha Motor Co., Ltd.FANUC Corp.Iseki & Co., Ltd.Hilti AGYASKAWA Electric Corp.SZ DJI Technology Co., Ltd.DAEWOO SHIPBUILDING & MARINE ENGINEERING Co., Ltd.NVIDIA Corp.JD.com, Inc.Miele & Cie. KGDana-Farber Cancer Institute, Inc.Mattel, Inc.Husqvarna ABLEGO A/SHaldor Topse A/SLEGO A/SNational Aeronautics & Space AdministrationThe Shenzhen Institutes of Advanced TechnologyThe Shenzhen Institutes of Advanced TechnologyWaymo LLCRyobi Ltd.Shibuya Corp.Tatsuno Corp.Nachi-Fujikoshi Corp.Bozhon Precision Industry Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AMicrosoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.Beijing Xiaomi Mobile Software Co., Ltd.
Fujitsu Ltd.Tencent Technology (Shenzhen) Co., Ltd.Yokogawa Electric Corp.Oracle America, Inc.Hewlett Packard Enterprise Development LPSeagate Technology LLCDelphi Technology, Inc.Dolby International ABLife Technologies Corp.Juniper Networks, Inc.Unisys Corp.Tata Consultancy Services Ltd.VMware, Inc.Inspur Electronic Information Industry Co., Ltd.Avaya, Inc.MiTAC International Corp.SnapTrack, Inc.Siemens Medical Solutions USA, Inc.Heroku, Inc.Agfa-Gevaert NVLandmark Graphics Corp.Fiberhome Telecommunication Technologies Co., Ltd.Shima Seiki Mfg. Ltd.Shima Seiki Mfg. Ltd.NARI Technology Co., Ltd.Rambus, Inc.Canon Marketing Japan, Inc.Bull SAPeking University Founder Group Corp.Red Hat, Inc.
Electronics & Telecommunications Research InstituteMattel, Inc.LEGO A/SLEGO A/SShenyang Institute of AutomationUBTECH Robotics Corp. Ltd.Ecovacs Robotics Co., Ltd.Hasbro, Inc.Spin Master Corp.IAI Corp.Kongsberg Maritime ASYujin Robot Co., Ltd.Aldebaran RoboticsMGA Entertainment, Inc.PaR Systems, Inc.Tolomatic, Inc.Wowwee Group Ltd.Fuji Soft, Inc.Simbe Robotics, Inc.Hanool Robotics Corp.Genesis Systems Group LLCMISUMI Group, Inc.Harvest CROO LLCRobotiq, Inc.Cobalt Robotics, Inc.Elenco Electronics, Inc.Bluefin Robotics Corp.DeLaval International ABNOOK Industries, Inc.Barrett Technology, Inc.
Brother Industries, Ltd.MicroVision, Inc.Avegant Corp.Total Immersion SAAnalogix Semiconductor, Inc.Zappar Ltd.Layar BV
Electronics & Telecommunications Research InstituteShenyang Institute of AutomationInnovation First, Inc.Restoration Robotics, Inc.PaR Systems, Inc.Genesis Systems Group LLCRobotiq, Inc.Zaytran, Inc.Makeblock Co., Ltd.Harvest Automation, Inc.Barrett Technology, Inc.Evollve, Inc.Modular Robotics, Inc.