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Toyota Motor Corp.Seiko Epson Corp.Honda Motor Co., Ltd.DENSO Corp.Midea Group Co. Ltd.FANUC Corp.Iseki & Co., Ltd.Hilti AGYASKAWA Electric Corp.SZ DJI Technology Co., Ltd.DAEWOO SHIPBUILDING & MARINE ENGINEERING Co., Ltd.NVIDIA Corp.JD.com, Inc.Miele & Cie. KGDana-Farber Cancer Institute, Inc.Mattel, Inc.Husqvarna ABLEGO A/SHaldor Topse A/SLEGO A/SNational Aeronautics & Space AdministrationThe Shenzhen Institutes of Advanced TechnologyQinetiQ Ltd.The Shenzhen Institutes of Advanced TechnologyWaymo LLCRenishaw PlcSRI InternationalRyobi Ltd.Shibuya Corp.Nachi-Fujikoshi Corp.
Cirque Corp.Tekscan, Inc.TRS Technologies, Inc.Pressure Profile Systems, Inc.Barrett Technology, Inc.
Bekaert SAOcado Innovation Ltd.Canon U.S.A., Inc.The Dun & Bradstreet Corp.Cooltech Applications SASWix.com Ltd.Barry Callebaut AGSaifun Semiconductors Ltd.Walker Edison Furniture Co. LLCThe Sharper Image Corp.Focus Technology Co., Ltd.Campina Melkunie BVOmnifone Ltd.JJA SASCentrient Pharmaceuticals Netherlands BVRotho Kunststoff AGAQUANOVA AGJohn Lewis PlcJohn Lewis & PartnersJohn Lewis PlcOil-Dri Corp. of AmericaOil-Dri Corp. of AmericaSSL International PlcNicast Ltd.Origin Wireless, Inc.Digital River, Inc.Ooni Ltd.Metro One Telecommunications, Inc.Youxinpai Beijing Information Technology Co., Ltd.Youxinpai Beijing Information Technology Co., Ltd.
Hitachi Ltd.LG Electronics, Inc.Toyota Motor Corp.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.ZTE Corp.Apple, Inc.Boe Innovation Investment Co. Ltd.Google LLCHoneywell International, Inc.Xerox Holdings Corp.Bayerische Motoren Werke AGAlcatel-Lucent S ANTT DOCOMO, Inc.Renesas Electronics Corp.Dow Global Technologies LLCMicrosoft Corp.Toshiba Lighting & Technology Corp.Toyoda Gosei Co., Ltd.Toshiba Lighting & Technology Corp.Hilti AGMediaTek, Inc.Aisin AW Co., Ltd.Boston Scientific Scimed, Inc.Advanced Micro Devices, Inc.Otis Elevator Co.
Interuniversitair Micro-Electronica Centrum VZWBando Chemical Industries Ltd.Palo Alto Research Center, Inc.Fujikura Kasei Co., Ltd.Brewer Science, Inc.CEMEDINE Co., Ltd.InkTec Co., Ltd.NthDegree Technologies Worldwide, Inc.Applied Nanotech Holdings, Inc.24M Technologies, Inc.Canatu OyNCC Nano LLCCorTec GmbHNuovo Film, Inc.The Sixth Element (Changzhou) Materials Technology Co., Ltd.The Sixth Element (Changzhou) Materials Technology Co., Ltd.Plextronics, Inc.Genes'Ink SASWise SrlNanogap Sub NM Powder SAEccrine Systems, Inc.Multi-Fineline Electronix, Inc.Karl Knauer KGInkron Ltd.Enerage, Inc.Next Biometrics Group ASBebop Sensors, Inc.Intrinsiq Materials, Inc.Jujo Chemical Co., Ltd.XG Sciences, Inc.
Sumy National Agrarian UniversitySiberian State Industrial UniversityInstitute of Strength Physics & Materials Science SB RASLadar
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University