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Ericsson, Inc.T-Mobile USA, Inc.Hiroshima UniversityEastern Communications Co., Ltd.Yonsei UniversityPCTEL, Inc.Alpha Networks, Inc.NextNav LLCShenzhen Infinova Ltd.Airspan Networks, Inc.Lookout, Inc.Twinhead International Corp.ArrayComm LLCKodiak Networks, Inc.Sepura Ltd.SAVOX Communications Oy ABMutualink, Inc.Telefónica Germany GmbH & Co. OHGOrange France SATechnische Universität KaiserslauternKirisun Communications Co. Ltd.Soliton Systems KKKirisun Communications Co. Ltd.Arris International, Inc.Redcom Laboratories, Inc.TCL Communication Technology Holdings Ltd.StreamWIDESmart Antenna Technologies Ltd.TRX Systems, Inc.UANGEL Corp.
Sony Group Corp.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.E.I. du Pont de Nemours & Co.EIDP, Inc.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.Electronics & Telecommunications Research InstituteMita Industrial Co., Ltd.
SMK Corp.Leviton Manufacturing Co., Inc.Bull Group Co. Ltd.Shanghai Dianke Electric Appliance Technology Co., Ltd.Cannon Electric Co.Rich Brand Industries Ltd.Sanyo Co. Ltd.Wenzhou MTLC Electric Appliance Co. Ltd.Connecteurs Electriques Deutsch SASI.C.P. SrlJiangsu Jiangyang Cable Co. Ltd.Partex Marking Systems ABEncore Wire Corp. (Delaware)Gaf Energy LLCABB Switzerland Ltd.Takamatsu Electric Works Ltd.Seidensha Co. Ltd.Intellon Corp.Ashley & Rock Ltd.SOMONT GmbHKimmon Electric Co. Ltd.Kimmon Electric Co. Ltd.Contactum Ltd.Orbit Technologies, Inc.United MS Electrical Mfg (M) Sdn. Bhd.Eagle Electric Manufacturing Co., Inc.Panasonic Life Solutions India Pvt Ltd.Corinex Communications Corp.Trigo SAEnsto Building Systems Oy
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University