With the analysis among 239 patents, we discovered top 74 key players by total patent application. Nippon Steel Co., Ltd., NGK Insulators, Ltd., Toyo Kohan Co., Ltd. are dominant in this area. They take 18.83% of the total patent filing.
Osaka-fu, Japan
Patent: 16
Aichi-ken, Japan
Patent: 15
Tokyo-to, Japan
Patent: 14
Tokyo-to, Japan
Patent: 11
Tokyo-to, Japan
Patent: 10
Samsung Electronics Co., Ltd.
Furukawa Electric Co., Ltd.
Saitama-ken, Japan
Patent: 8
With the analysis among 1 patents, we discovered top 1 start-ups by total patent application.
Gyeonggi-do, South Korea
Patent: 1
With the analysis among related 58 patents applied in the last 5 years. We discover 16 most active companies in this area. The fast-growing Nippon Steel Co., Ltd., NGK Insulators, Ltd., Nippon Micrometal Corp. take 67.24% of patent filing during this period.
Osaka-fu, Japan
Patent: 16
Aichi-ken, Japan
Patent: 15
Saitama-ken, Japan
Patent: 8
Panasonic Intellectual Property Management Co. Ltd.
Furukawa Electric Co., Ltd.
Japan Chemical Industries Co. Ltd.
Nikko Metal Manufacturing Co. Ltd.
Mitsubishi Materials Corp.
With the analysis among related 58 patents in last 5 years, we discover 9 new entrants. Nippon Steel Co., Ltd., NGK Insulators, Ltd., Nippon Micrometal Corp. are the most active new entrants in this area.
Osaka-fu, Japan
Patent: 16
Aichi-ken, Japan
Patent: 15
Saitama-ken, Japan
Patent: 8
Panasonic Intellectual Property Management Co. Ltd.
Japan Chemical Industries Co. Ltd.
Kanagawa-ken, Japan
Patent: 1
Wuhan University of Science & Technology
Hubei Sheng, China
Patent: 1
With the analysis among 19 patents, we discovered top 4 universities and scientific research institutions by total patent application. Korea Institute of Science & Technology, Xiamen University, Wuhan University of Science & Technology are dominant in this area. They take 36.84% of the total patent filing.
Korea Institute of Science & Technology
Fujian Sheng, China
Patent: 1
Wuhan University of Science & Technology
Hubei Sheng, China
Patent: 1
China University of Geosciences
Beijing Shi, China
Patent: 1