Search results for “Bond interface” companies
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Key Players
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Innovation Intensity
With the analysis among 2,345 patents, we discovered top 475 key players by total patent application. Mitsubishi Materials Corp., Soitec SA, Invensas Bonding Technologies, Inc. are dominant in this area. They take 12.54% of the total patent filing.
Mitsubishi Materials Corp.
Tokyo-to, Japan
Patent: 124
Soitec SA
France
Patent: 111
Invensas Bonding Technologies, Inc.
North Carolina, United States
Patent: 59
Senju Metal Industry Co., Ltd.
Tokyo-to, Japan
Patent: 48
STARTUP
Yangtze Memory Technologies Co., Ltd.
Hubei Sheng, China
Patent: 39
TOSHIBA Corp.
Tokyo-to, Japan
Patent: 39
International Business Machines Corp.
New York, United States
Patent: 33
Shin-Etsu Handotai Co., Ltd.
Tokyo-to, Japan
Patent: 30
Hitachi Ltd.
Tokyo-to, Japan
Patent: 29
Corning, Inc.
New York, United States
Patent: 27
Startups & Unicorns
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Innovation Intensity
With the analysis among 41 patents, we discovered top 2 start-ups by total patent application.
STARTUP
Yangtze Memory Technologies Co., Ltd.
Hubei Sheng, China
Patent: 39
STARTUP
Arris Composites, Inc.
California, United States
Patent: 2
Fast-Growing
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Innovation in recent 5 years
With the analysis among related 633 patents applied in the last 5 years. We discover 285 most active companies in this area. The fast-growing Invensas Bonding Technologies, Inc., Yangtze Memory Technologies Co., Ltd., Mitsubishi Materials Corp. take 17.69% of patent filing during this period.
Invensas Bonding Technologies, Inc.
North Carolina, United States
Patent: 38
STARTUP
Yangtze Memory Technologies Co., Ltd.
Hubei Sheng, China
Patent: 38
Mitsubishi Materials Corp.
Tokyo-to, Japan
Patent: 36
Soitec SA
France
Patent: 28
Senju Metal Industry Co., Ltd.
Tokyo-to, Japan
Patent: 24
Tohoku University
Miyagi-ken, Japan
Patent: 15
Commissariat à l´énergie atomique et aux énergies alternatives
CENTRE COUNTY, France
Patent: 14
Canon Anelva Corp.
Tokyo-to, Japan
Patent: 10
JFE Steel Corp.
Tokyo-to, Japan
Patent: 8
Intel Corp.
California, United States
Patent: 8
New Entrants
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Innovation in recent 5 years
With the analysis among related 633 patents in last 5 years, we discover 192 new entrants. Canon Anelva Corp., Intel Corp., Xiamen University are the most active new entrants in this area.
Canon Anelva Corp.
Tokyo-to, Japan
Patent: 10
Intel Corp.
California, United States
Patent: 8
Xiamen University
Fujian Sheng, China
Patent: 6
Applied Materials, Inc.
California, United States
Patent: 6
Adeia Semiconductor Bonding Technologies, Inc.
Delaware, United States
Patent: 6
Osaka University
Osaka-fu, Japan
Patent: 5
Xilinx, Inc.
California, United States
Patent: 5
Tokyo Electron Ltd.
Tokyo-to, Japan
Patent: 5
China First Heavy Industries
Heilongjiang Sheng, China
Patent: 4
SEMES Co., Ltd.
South Korea
Patent: 4
Research Institutions
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Innovation Intensity
With the analysis among 380 patents, we discovered top 116 universities and scientific research institutions by total patent application. Tohoku University, Shanghai Institute of Microsystem & Information Technology, Taiyuan University of Technology are dominant in this area. They take 11.58% of the total patent filing.
Tohoku University
Miyagi-ken, Japan
Patent: 24
Shanghai Institute of Microsystem & Information Technology
Shanghai Shi, China
Patent: 10
Taiyuan University of Technology
Shanxi Sheng, China
Patent: 9
Nanjing University of Science & Technology
Jiangsu Sheng, China
Patent: 9
Chongqing University
Chongqing Shi, China
Patent: 7
Technical University of Denmark
Hovedstaden, Denmark
Patent: 6
Xiamen University
Fujian Sheng, China
Patent: 6
Xi'an University of Technology
Shaanxi Sheng, China
Patent: 6
Institute of Semiconductors of Chinese Academy of Sciences
Beijing Shi, China
Patent: 6
Massachusetts Institute of Technology
Massachusetts, United States
Patent: 5
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