Search results for “Bonded interface” companies
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Key Players
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Innovation Intensity
With the analysis among 577 patents, we discovered top 202 key players by total patent application. Mitsubishi Materials Corp., Invensas Bonding Technologies, Inc., Senju Metal Industry Co., Ltd. are dominant in this area. They take 15.60% of the total patent filing.
Tokyo-to, Japan
Patent: 48
North Carolina, United States
Patent: 24
Tokyo-to, Japan
Patent: 18
Vermont, United States
Patent: 17
New York, United States
Patent: 13
New Jersey, United States
Patent: 11
New York, United States
Patent: 11
Delaware, United States
Patent: 10
Tokyo-to, Japan
Patent: 10
Oregon, United States
Patent: 9
Startups & Unicorns
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Innovation Intensity
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Fast-Growing
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Innovation in recent 5 years
With the analysis among related 103 patents applied in the last 5 years. We discover 45 most active companies in this area. The fast-growing Mitsubishi Materials Corp., Senju Metal Industry Co., Ltd., Invensas Bonding Technologies, Inc. take 38.83% of patent filing during this period.
Tokyo-to, Japan
Patent: 18
Tokyo-to, Japan
Patent: 17
North Carolina, United States
Patent: 5
Miyagi-ken, Japan
Patent: 4
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Patent: 4
Oregon, United States
Patent: 4
Tokyo-to, Japan
Patent: 3
California, United States
Patent: 3
Shanxi Sheng, China
Patent: 2
Japan
Patent: 2
New Entrants
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Innovation in recent 5 years
With the analysis among related 103 patents in last 5 years, we discover 28 new entrants. Canon Anelva Corp., Invensas LLC, North University of China are the most active new entrants in this area.
Tokyo-to, Japan
Patent: 3
California, United States
Patent: 3
Shanxi Sheng, China
Patent: 2
Jiangsu Sheng, China
Patent: 2
Tokyo-to, Japan
Patent: 2
Osaka-fu, Japan
Patent: 2
California, United States
Patent: 2
Tokyo-to, Japan
Patent: 2
California, United States
Patent: 2
Heilongjiang Sheng, China
Patent: 1
Research Institutions
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Innovation Intensity
With the analysis among 71 patents, we discovered top 30 universities and scientific research institutions by total patent application. Tohoku University, University of Tokyo, Université Laval are dominant in this area. They take 22.54% of the total patent filing.
Miyagi-ken, Japan
Patent: 6
Tokyo-to, Japan
Patent: 5
Quebec, Canada
Patent: 4
Massachusetts, United States
Patent: 2
Central Region, Singapore
Patent: 2
Osaka-fu, Japan
Patent: 2
Beijing Shi, China
Patent: 2
Aichi-ken, Japan
Patent: 2
Shaanxi Sheng, China
Patent: 2
Shanxi Sheng, China
Patent: 2
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