Search results for “Electroless deposition” companies
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Key Players
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Innovation Intensity
With the analysis among 2,153 patents, we discovered top 438 key players by total patent application. Lam Research Corp., Applied Materials, Inc., International Business Machines Corp. are dominant in this area. They take 18.49% of the total patent filing.
Lam Research Corp.
California, United States
Patent: 184
Applied Materials, Inc.
California, United States
Patent: 132
International Business Machines Corp.
New York, United States
Patent: 82
Atotech Deutschland GmbH & Co. KG
Berlin, Germany
Patent: 73
BASF AB
Sweden
Patent: 55
Koninklijke Philips NV
Noord-Holland, Netherlands
Patent: 50
Intel Corp.
California, United States
Patent: 45
Enthone, Inc.
Indiana, United States
Patent: 37
General Electric Co.
Massachusetts, United States
Patent: 32
Kollmorgen Corp.
Virginia, United States
Patent: 32
Startups & Unicorns
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Innovation Intensity
With the analysis among 7 patents, we discovered top 4 start-ups by total patent application. Aisin KK, Mxt, Inc., Origin Quantum Computing Technology Co. Ltd. are active in this area.
STARTUP
Aisin KK
Tokyo-to, Japan
Patent: 3
STARTUP
Mxt, Inc.
California, United States
Patent: 2
STARTUP
Origin Quantum Computing Technology Co. Ltd.
Anhui Sheng, China
Patent: 1
STARTUP
LumiShield Technologies, Inc.
Pennsylvania, United States
Patent: 1
Fast-Growing
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Innovation in recent 5 years
With the analysis among related 368 patents applied in the last 5 years. We discover 208 most active companies in this area. The fast-growing Lam Research Corp., BOE Technology Group Co., Ltd., Catlam LLC take 10.05% of patent filing during this period.
Lam Research Corp.
California, United States
Patent: 14
BOE Technology Group Co., Ltd.
Beijing Shi, China
Patent: 14
Catlam LLC
United States
Patent: 9
Oxford Nanosystems Ltd.
United Kingdom
Patent: 8
Taiwan Semiconductor Manufacturing Co., Ltd.
Taiwan Province, China
Patent: 5
Yangzhou University
Jiangsu Sheng, China
Patent: 5
National Cheng Kung University
Taiwan Province, China
Patent: 5
Applied Materials, Inc.
California, United States
Patent: 5
Huazhong University of Science & Technology
Hubei Sheng, China
Patent: 5
Dalian University
Liaoning Sheng, China
Patent: 4
New Entrants
Order by:
Innovation in recent 5 years
With the analysis among related 368 patents in last 5 years, we discover 178 new entrants. BOE Technology Group Co., Ltd., Catlam LLC, National Cheng Kung University are the most active new entrants in this area.
BOE Technology Group Co., Ltd.
Beijing Shi, China
Patent: 14
Catlam LLC
United States
Patent: 9
National Cheng Kung University
Taiwan Province, China
Patent: 5
Yangzhou University
Jiangsu Sheng, China
Patent: 5
Huazhong University of Science & Technology
Hubei Sheng, China
Patent: 5
Dalian University
Liaoning Sheng, China
Patent: 4
AAC Raytech Module (Nanning) Technologies Co., Ltd.
Jiangsu Sheng, China
Patent: 4
South China Agricultural University
Guangdong Sheng, China
Patent: 4
Heilongjiang Haizhen Technology Co., Ltd.
Heilongjiang Sheng, China
Patent: 4
SEMSYSCO GmbH
Salzburg, Austria
Patent: 4
Research Institutions
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Innovation Intensity
With the analysis among 329 patents, we discovered top 130 universities and scientific research institutions by total patent application. University of Windsor, Dresden University of Technology, The Trustees of Columbia University in The City of New York are dominant in this area. They take 10.33% of the total patent filing.
University of Windsor
Ontario, Canada
Patent: 12
Dresden University of Technology
Sachsen, Germany
Patent: 8
The Trustees of Columbia University in The City of New York
New York, United States
Patent: 5
University of Warsaw
Mazowieckie, Poland
Patent: 5
National Cheng Kung University
Taiwan Province, China
Patent: 5
Huazhong University of Science & Technology
Hubei Sheng, China
Patent: 5
Yangzhou University
Jiangsu Sheng, China
Patent: 5
University of South Carolina
South Carolina, United States
Patent: 4
Nanyang Technological University
Central Region, Singapore
Patent: 4
Hubei University
Hubei Sheng, China
Patent: 4
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