Search results for “Hard spheres” companies
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Key Players
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Innovation Intensity
With the analysis among 245 patents, we discovered top 124 key players by total patent application. Sumitomo Rubber Industries, Ltd., Matsushita Electronics Corp., Mitutoyo Corp. are dominant in this area. They take 11.02% of the total patent filing.
Kyoto-fu, Japan
Patent: 10
Osaka-fu, Japan
Patent: 9
Kanagawa-ken, Japan
Patent: 8
Tokyo-to, Japan
Patent: 7
Illinois, United States
Patent: 6
Tokyo-to, Japan
Patent: 6
Omnisent LLC
United States
Patent: 6
Tokyo-to, Japan
Patent: 4
New York, United States
Patent: 4
Tokyo-to, Japan
Patent: 4
Startups & Unicorns
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Innovation Intensity
With the analysis among 1 patents, we discovered top 1 start-ups by total patent application.
STARTUP
Guangdong Sheng, China
Patent: 1
Fast-Growing
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Innovation in recent 5 years
With the analysis among related 17 patents applied in the last 5 years. We discover 7 most active companies in this area. The fast-growing Omnisent LLC, Mitsubishi Materials Corp., China ENFI Engineering Corp. take 52.94% of patent filing during this period.
Omnisent LLC
United States
Patent: 5
Tokyo-to, Japan
Patent: 2
Beijing Shi, China
Patent: 2
Beijing Shi, China
Patent: 1
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Patent: 1
Kyoto-fu, Japan
Patent: 1
STARTUP
Guangdong Sheng, China
Patent: 1
New Entrants
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Innovation in recent 5 years
With the analysis among related 17 patents in last 5 years, we discover 4 new entrants. China ENFI Engineering Corp., Shenzhen Advanced Electronic Materials International Innovation Research Institute, Kyoto University are the most active new entrants in this area.
Beijing Shi, China
Patent: 2
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Patent: 1
Kyoto-fu, Japan
Patent: 1
STARTUP
Guangdong Sheng, China
Patent: 1
Research Institutions
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Innovation Intensity
With the analysis among 17 patents, we discovered top 8 universities and scientific research institutions by total patent application. Clarkson University, Institute of Process Engineering, Chinese Academy of Sciences, Kyoto University are dominant in this area. They take 29.41% of the total patent filing.
New York, United States
Patent: 2
Beijing Shi, China
Patent: 2
Kyoto-fu, Japan
Patent: 1
Miyagi-ken, Japan
Patent: 1
Heilongjiang Sheng, China
Patent: 1
Nara-ken, Japan
Patent: 1
Hubei Sheng, China
Patent: 1
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Patent: 1
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