Search results for “High-Speed Uplink Packet Access” companies
Free sign up to view the full data
Key Players
Order by:
Innovation Intensity
With the analysis among 639 patents, we discovered top 75 key players by total patent application. ZTE Corp., QUALCOMM, Inc., Huawei Technologies Co., Ltd. are dominant in this area. They take 39.75% of the total patent filing.
ZTE Corp.
Guangdong Sheng, China
Patent: 102
QUALCOMM, Inc.
California, United States
Patent: 94
Huawei Technologies Co., Ltd.
Guangdong Sheng, China
Patent: 58
InterDigital Technology Corp.
Delaware, United States
Patent: 44
PT Nokia Corp.
Jakarta Raya, Indonesia
Patent: 36
Datang Mobile Communications Equipment Co. Ltd.
Beijing Shi, China
Patent: 31
Nokia Technologies Oy
Finland
Patent: 29
TD Tech Ltd.
Beijing Shi, China
Patent: 28
Intel Corp.
California, United States
Patent: 26
LG Electronics, Inc.
South Korea
Patent: 26
Startups & Unicorns
Order by:
Innovation Intensity
With the analysis among 2 patents, we discovered top 1 start-ups by total patent application.
STARTUP
Xfusion Digital Technologies Co. Ltd.
Henan Sheng, China
Patent: 2
Fast-Growing
Order by:
Innovation in recent 5 years
With the analysis among related 1 patents applied in the last 5 years. We discover 1 most active companies in this area.
Telefonaktiebolaget LM Ericsson
Sweden
Patent: 1
New Entrants
Order by:
Innovation in recent 5 years
No data, please try another search term
Research Institutions
Order by:
Innovation Intensity
With the analysis among 8 patents, we discovered top 4 universities and scientific research institutions by total patent application. Beijing University of Posts & Telecommunications, Peking University, Qingdao University of Science & Technology are dominant in this area. They take 50.00% of the total patent filing.
Beijing University of Posts & Telecommunications
Beijing Shi, China
Patent: 2
Peking University
Beijing Shi, China
Patent: 1
Qingdao University of Science & Technology
Shandong Sheng, China
Patent: 1
Chongqing University of Posts and Telecommunications
Chongqing Shi, China
Patent: 1
Keywords Quick Entry
Popular
Physics
Chemistry
Engineering
Materials science
Computer science
Biology
Medicine
MetalElectrodeVoltageSemiconductorPolymerElectricityCoatingFiberDisplay deviceRaw materialElectric motorUltimate tensile strengthNozzleCarbonBuilding constructionAlkylService lifeElectronOxideOxygenSolventControl unitFlangeControl systemDrugLight sourcePistonDiseaseElectric powerHigh pressure
View more
Page generation time: