Search results for “Logical part” companies
Free sign up to view the full data
Key Players
Order by:
Innovation Intensity
With the analysis among 1,605 patents, we discovered top 344 key players by total patent application. Hitachi Ltd., NEC Corp., Samsung Electronics Co., Ltd. are dominant in this area. They take 20.75% of the total patent filing.
Hitachi Ltd.
Tokyo-to, Japan
Patent: 148
NEC Corp.
Tokyo-to, Japan
Patent: 106
Samsung Electronics Co., Ltd.
South Korea
Patent: 79
International Business Machines Corp.
New York, United States
Patent: 65
TOSHIBA Corp.
Tokyo-to, Japan
Patent: 59
Fujitsu Ltd.
Tokyo-to, Japan
Patent: 47
Renesas Electronics Corp.
Tokyo-to, Japan
Patent: 46
Mitsubishi Electric Corp.
Tokyo-to, Japan
Patent: 38
SK hynix, Inc.
South Korea
Patent: 32
Sony Group Corp.
Tokyo-to, Japan
Patent: 30
Startups & Unicorns
Order by:
Innovation Intensity
With the analysis among 4 patents, we discovered top 2 start-ups by total patent application.
STARTUP
ADLATUS Robotics GmbH
Baden-Württemberg, Germany
Patent: 2
STARTUP
Aisin KK
Tokyo-to, Japan
Patent: 2
Fast-Growing
Order by:
Innovation in recent 5 years
With the analysis among related 42 patents applied in the last 5 years. We discover 29 most active companies in this area. The fast-growing Samsung Electronics Co., Ltd., American Industrial & Construction Supply, Inc., Mitsubishi Electric Corp. take 30.95% of patent filing during this period.
Samsung Electronics Co., Ltd.
South Korea
Patent: 6
American Industrial & Construction Supply, Inc.
Colorado, United States
Patent: 4
Mitsubishi Electric Corp.
Tokyo-to, Japan
Patent: 3
Intel Corp.
California, United States
Patent: 2
Siemens Industry Software, Inc.
Texas, United States
Patent: 1
Everspin Technologies, Inc.
Arizona, United States
Patent: 1
Wisconsin Alumni Research Foundation
Wisconsin, United States
Patent: 1
Geovis Technology Co., Ltd.
Beijing Shi, China
Patent: 1
Hefei Lidong Software Development Co., Ltd.
Anhui Sheng, China
Patent: 1
NXP USA, Inc.
Texas, United States
Patent: 1
New Entrants
Order by:
Innovation in recent 5 years
With the analysis among related 42 patents in last 5 years, we discover 13 new entrants. American Industrial & Construction Supply, Inc., Siemens Industry Software, Inc., Wuhan KOTEI Informatics Co., Ltd. are the most active new entrants in this area.
American Industrial & Construction Supply, Inc.
Colorado, United States
Patent: 4
Siemens Industry Software, Inc.
Texas, United States
Patent: 1
Wuhan KOTEI Informatics Co., Ltd.
Hubei Sheng, China
Patent: 1
Everspin Technologies, Inc.
Arizona, United States
Patent: 1
Inglass SpA
Italy
Patent: 1
Zhejiang University
Zhejiang Sheng, China
Patent: 1
Geovis Technology Co., Ltd.
Beijing Shi, China
Patent: 1
Hefei Lidong Software Development Co., Ltd.
Anhui Sheng, China
Patent: 1
Guangzhou Tencent Technology Co., Ltd.
Guangdong Sheng, China
Patent: 1
Harbin University of Science & Technology
Heilongjiang Sheng, China
Patent: 1
Research Institutions
Order by:
Innovation Intensity
With the analysis among 38 patents, we discovered top 12 universities and scientific research institutions by total patent application. Fudan University, Railway Technical Research Institute, Shanghai Jiao Tong University are dominant in this area. They take 28.95% of the total patent filing.
Fudan University
Shanghai Shi, China
Patent: 2
Railway Technical Research Institute
Japan
Patent: 2
Shanghai Jiao Tong University
Shanghai Shi, China
Patent: 1
Zhejiang University
Zhejiang Sheng, China
Patent: 1
Beihang University
Beijing Shi, China
Patent: 1
Beijing Jiaotong University
Beijing Shi, China
Patent: 1
Nanjing University of Aeronautics & Astronautics
Jiangsu Sheng, China
Patent: 1
Harbin University of Science & Technology
Heilongjiang Sheng, China
Patent: 1
North China University of Science & Technology
Hebei Sheng, China
Patent: 1
Southeast University
Jiangsu Sheng, China
Patent: 1
Keywords Quick Entry
Popular
Physics
Chemistry
Engineering
Materials science
Computer science
Biology
Medicine
MetalElectrodeVoltageSemiconductorPolymerElectricityCoatingFiberDisplay deviceRaw materialElectric motorUltimate tensile strengthNozzleCarbonBuilding constructionAlkylService lifeElectronOxideOxygenSolventControl unitFlangeControl systemDrugLight sourcePistonDiseaseElectric powerHigh pressure
View more
Page generation time: