Search results for “Loop stability” companies
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Key Players
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Innovation Intensity
With the analysis among 333 patents, we discovered top 189 key players by total patent application. Microchip Technology, Inc., QUALCOMM, Inc., Samsung Electronics Co., Ltd. are dominant in this area. They take 8.41% of the total patent filing.
Microchip Technology, Inc.
Arizona, United States
Patent: 11
QUALCOMM, Inc.
California, United States
Patent: 9
Samsung Electronics Co., Ltd.
South Korea
Patent: 8
Micron Technology, Inc.
Idaho, United States
Patent: 7
Intersil Corp.
California, United States
Patent: 7
Thomson Consumer Electronics, Inc.
United States
Patent: 7
Chengdu Analog Circuit Technology, Inc.
Sichuan Sheng, China
Patent: 6
NXP Semiconductors (Thailand) Co., Ltd.
Thailand
Patent: 6
Sunplus Technology Co., Ltd.
Taiwan Province, China
Patent: 6
Toray Industries, Inc.
Tokyo-to, Japan
Patent: 5
Startups & Unicorns
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Innovation Intensity
With the analysis among 2 patents, we discovered top 2 start-ups by total patent application.
STARTUP
OPT Industries, Inc.
Massachusetts, United States
Patent: 1
STARTUP
Southchip Semiconductor Technology (Shanghai) Co., Ltd.
Shanghai Shi, China
Patent: 1
Fast-Growing
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Innovation in recent 5 years
With the analysis among related 109 patents applied in the last 5 years. We discover 79 most active companies in this area. The fast-growing University of Electronic Science & Technology of China, Amlogic (Shanghai) Co., Ltd., Shanghai Hailechuang Microelectronics Co., Ltd. take 19.27% of patent filing during this period.
University of Electronic Science & Technology of China
Sichuan Sheng, China
Patent: 12
Amlogic (Shanghai) Co., Ltd.
Shanghai Shi, China
Patent: 5
Shanghai Hailechuang Microelectronics Co., Ltd.
Shanghai Shi, China
Patent: 4
Hefei University of Technology
Anhui Sheng, China
Patent: 3
Yanshan University
Hebei Sheng, China
Patent: 3
Nanjing University of Aeronautics & Astronautics
Jiangsu Sheng, China
Patent: 3
Shandong Power Equipment Co., Ltd.
Shandong Sheng, China
Patent: 2
M31 Technology Corp.
Taiwan Province, China
Patent: 2
Ciena Corp.
United States
Patent: 2
Shijiazhuang Tonhe Electronics Technologies Co., Ltd.
Hebei Sheng, China
Patent: 2
New Entrants
Order by:
Innovation in recent 5 years
With the analysis among related 109 patents in last 5 years, we discover 71 new entrants. Amlogic (Shanghai) Co., Ltd., Shanghai Hailechuang Microelectronics Co., Ltd., Hefei University of Technology are the most active new entrants in this area.
Amlogic (Shanghai) Co., Ltd.
Shanghai Shi, China
Patent: 5
Shanghai Hailechuang Microelectronics Co., Ltd.
Shanghai Shi, China
Patent: 4
Hefei University of Technology
Anhui Sheng, China
Patent: 3
Yanshan University
Hebei Sheng, China
Patent: 3
Shandong Power Equipment Co., Ltd.
Shandong Sheng, China
Patent: 2
M31 Technology Corp.
Taiwan Province, China
Patent: 2
Ciena Corp.
United States
Patent: 2
Shijiazhuang Tonhe Electronics Technologies Co., Ltd.
Hebei Sheng, China
Patent: 2
University of Science & Technology of China
Anhui Sheng, China
Patent: 2
Chengdu University of Information Technology
Sichuan Sheng, China
Patent: 2
Research Institutions
Order by:
Innovation Intensity
With the analysis among 112 patents, we discovered top 43 universities and scientific research institutions by total patent application. Hainan University, University of Electronic Science & Technology of China, Zhejiang University are dominant in this area. They take 34.82% of the total patent filing.
Hainan University
Hainan Sheng, China
Patent: 18
University of Electronic Science & Technology of China
Sichuan Sheng, China
Patent: 15
Zhejiang University
Zhejiang Sheng, China
Patent: 6
Northwestern Polytechnical University
Shaanxi Sheng, China
Patent: 5
Nanjing University of Aeronautics & Astronautics
Jiangsu Sheng, China
Patent: 4
South China University of Technology
Guangdong Sheng, China
Patent: 3
Hefei University of Technology
Anhui Sheng, China
Patent: 3
Yanshan University
Hebei Sheng, China
Patent: 3
University of Science & Technology Beijing
Beijing Shi, China
Patent: 3
Central South University
Hunan Sheng, China
Patent: 2
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