Search results for “Perpendicular coercivity” companies
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Key Players
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Innovation Intensity
With the analysis among 65 patents, we discovered top 28 key players by total patent application. Sony Group Corp., Samsung Electronics Co., Ltd., Resonac Holdings Corp. are dominant in this area. They take 50.77% of the total patent filing.
Sony Group Corp.
Tokyo-to, Japan
Patent: 17
Samsung Electronics Co., Ltd.
South Korea
Patent: 9
Resonac Holdings Corp.
Chiba-ken, Japan
Patent: 7
NEC Corp.
Tokyo-to, Japan
Patent: 3
TOSHIBA Corp.
Tokyo-to, Japan
Patent: 3
International Business Machines Corp.
New York, United States
Patent: 2
Kao Corp.
Tokyo-to, Japan
Patent: 2
SANYO Electric Co., Ltd.
California, United States
Patent: 2
Fuji Electric Device Technology Co., Ltd.
Kanagawa-ken, Japan
Patent: 2
Hitachi Maxwell Ltd.
United States
Patent: 2
Startups & Unicorns
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Innovation Intensity
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Fast-Growing
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Innovation in recent 5 years
With the analysis among related 7 patents applied in the last 5 years. We discover 3 most active companies in this area.
Sony Group Corp.
Tokyo-to, Japan
Patent: 6
Shanghai University
Shanghai Shi, China
Patent: 1
Advanced Industrial Science & Technology
Tokyo-to, Japan
Patent: 1
New Entrants
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Innovation in recent 5 years
With the analysis among related 7 patents in last 5 years, we discover 2 new entrants.
Shanghai University
Shanghai Shi, China
Patent: 1
Advanced Industrial Science & Technology
Tokyo-to, Japan
Patent: 1
Research Institutions
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Innovation Intensity
With the analysis among 7 patents, we discovered top 5 universities and scientific research institutions by total patent application. Carnegie Mellon University, Fudan University, Korea Institute of Science & Technology are dominant in this area. They take 57.14% of the total patent filing.
Carnegie Mellon University
Pennsylvania, United States
Patent: 2
Fudan University
Shanghai Shi, China
Patent: 1
Korea Institute of Science & Technology
South Korea
Patent: 1
Institute of Semiconductors of Chinese Academy of Sciences
Beijing Shi, China
Patent: 1
Shanghai University
Shanghai Shi, China
Patent: 1
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