Search results for “Radiation hardening” companies
Free sign up to view the full data
Key Players
Order by:
Innovation Intensity
With the analysis among 904 patents, we discovered top 320 key players by total patent application. BASF AB, Honeywell International Technologies Ltd., Covestro Pty Ltd. are dominant in this area. They take 13.05% of the total patent filing.
BASF AB
Sweden
Patent: 70
Honeywell International Technologies Ltd.
DUBLIN, Ireland
Patent: 25
Covestro Pty Ltd.
Australia
Patent: 23
Dai Nippon Printing Co., Ltd.
Tokyo-to, Japan
Patent: 19
Furukawa Electric Co., Ltd.
Tokyo-to, Japan
Patent: 18
Nitto Denko Corp.
Osaka-fu, Japan
Patent: 17
Siemens AG
Bayern, Germany
Patent: 14
3M Innovative Properties Co.
Minnesota, United States
Patent: 12
MXTronics Corp.
Beijing Shi, China
Patent: 11
DSM IP Assets BV
Netherlands
Patent: 11
Startups & Unicorns
Order by:
Innovation Intensity
With the analysis among 2 patents, we discovered top 2 start-ups by total patent application.
STARTUP
AddiFab ApS
Denmark
Patent: 1
STARTUP
Nanovision Technology (Beijing) Co. Ltd.
Beijing Shi, China
Patent: 1
Fast-Growing
Order by:
Innovation in recent 5 years
With the analysis among related 104 patents applied in the last 5 years. We discover 60 most active companies in this area. The fast-growing Beijing Microelectronics Technology Institute, MXTronics Corp., Dalian University of Technology take 19.23% of patent filing during this period.
Beijing Microelectronics Technology Institute
Beijing Shi, China
Patent: 8
MXTronics Corp.
Beijing Shi, China
Patent: 7
Dalian University of Technology
Liaoning Sheng, China
Patent: 5
Harbin Institute of Technology
Heilongjiang Sheng, China
Patent: 4
National University of Defense Technology
Hunan Sheng, China
Patent: 4
Nitto Denko Corp.
Osaka-fu, Japan
Patent: 4
Honeywell International Technologies Ltd.
DUBLIN, Ireland
Patent: 4
BAE Systems Information & Electronic Sys Integration, Inc.
New Hampshire, United States
Patent: 3
The 58th Research Institute of China Electronics Technology Group Corporation
undefined undefined
Patent: 3
The 24th Research Institute of China Electronics Technology Corporation
undefined undefined
Patent: 3
New Entrants
Order by:
Innovation in recent 5 years
With the analysis among related 104 patents in last 5 years, we discover 39 new entrants. Dalian University of Technology, The 24th Research Institute of China Electronics Technology Corporation, IceMos Technology Corp. are the most active new entrants in this area.
Dalian University of Technology
Liaoning Sheng, China
Patent: 5
The 24th Research Institute of China Electronics Technology Corporation
undefined undefined
Patent: 3
IceMos Technology Corp.
Arizona, United States
Patent: 2
Fudan University
Shanghai Shi, China
Patent: 2
DENTSPLY International, Inc.
Pennsylvania, United States
Patent: 2
Xi'an Institute of Microelectronics Technology
undefined undefined
Patent: 2
University of Electronic Science & Technology of China
Sichuan Sheng, China
Patent: 2
Eaton Intelligent Power Ltd.
DUBLIN, Ireland
Patent: 2
Soochow University
Jiangsu Sheng, China
Patent: 1
SIRONA Dental Systems GmbH
Hessen, Germany
Patent: 1
Research Institutions
Order by:
Innovation Intensity
With the analysis among 135 patents, we discovered top 38 universities and scientific research institutions by total patent application. Beijing Microelectronics Technology Institute, Harbin Institute of Technology, National University of Defense Technology are dominant in this area. They take 20.74% of the total patent filing.
Beijing Microelectronics Technology Institute
Beijing Shi, China
Patent: 9
Harbin Institute of Technology
Heilongjiang Sheng, China
Patent: 8
National University of Defense Technology
Hunan Sheng, China
Patent: 7
Arizona State University
Arizona, United States
Patent: 4
Technische Universität Wien
Wien, Austria
Patent: 4
Tianjin University
Tianjin Shi, China
Patent: 3
Fudan University
Shanghai Shi, China
Patent: 2
University of Electronic Science & Technology of China
Sichuan Sheng, China
Patent: 2
Harbin Engineering University
Heilongjiang Sheng, China
Patent: 2
National Cheng Kung University
Taiwan Province, China
Patent: 2
Keywords Quick Entry
Popular
Physics
Chemistry
Engineering
Materials science
Computer science
Biology
Medicine
MetalElectrodeVoltageSemiconductorPolymerElectricityCoatingFiberDisplay deviceRaw materialElectric motorUltimate tensile strengthNozzleCarbonBuilding constructionAlkylService lifeElectronOxideOxygenSolventControl unitFlangeControl systemDrugLight sourcePistonDiseaseElectric powerHigh pressure
View more
Page generation time: