With the analysis among 178 patents, we discovered top 96 key players by total patent application. Senoplast Klepsch & Co. GmbH & Co. KG, Samsung Electronics Co., Ltd., Samsung SDI Co., Ltd. are dominant in this area. They take 14.04% of the total patent filing.
Senoplast Klepsch & Co. GmbH & Co. KG
Samsung Electronics Co., Ltd.
Chungcheongnam-do, South Korea
Patent: 8
New York, United States
Patent: 6
Mitsubishi Pencil Co., Ltd.
Miyazaki-ken, Japan
Patent: 6
Svenska Kullagerfabriken AB
Sekisui Chemical Co., Ltd.
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With the analysis among related 28 patents applied in the last 5 years. We discover 10 most active companies in this area. The fast-growing Corning, Inc., ASAHI YUKIZAI Corp., European Mud Co. AS take 57.14% of patent filing during this period.
New York, United States
Patent: 6
Miyazaki-ken, Japan
Patent: 6
Rogaland, Norway
Patent: 4
SHPP Global Technologies BV
Zhangzhou Hexing Paint Co., Ltd.
Fujian Sheng, China
Patent: 1
Suzhou Meixin Testing Technology Co., Ltd.
Jiangsu Sheng, China
Patent: 1
Sumitomo Bakelite Co., Ltd.
Mitsubishi Pencil Co., Ltd.
Daiwabo Holdings Co., Ltd.
With the analysis among related 28 patents in last 5 years, we discover 8 new entrants. Corning, Inc., ASAHI YUKIZAI Corp., European Mud Co. AS are the most active new entrants in this area.
New York, United States
Patent: 6
Miyazaki-ken, Japan
Patent: 6
Rogaland, Norway
Patent: 4
SHPP Global Technologies BV
Zhangzhou Hexing Paint Co., Ltd.
Fujian Sheng, China
Patent: 1
Suzhou Meixin Testing Technology Co., Ltd.
Jiangsu Sheng, China
Patent: 1
Daiwabo Holdings Co., Ltd.
With the analysis among 9 patents, we discovered top 4 universities and scientific research institutions by total patent application. Tokyo University of Science, Beijing Forestry University, Ivano-Frankivsk National Technical University of Oil & Gas are dominant in this area. They take 100.00% of the total patent filing.
Tokyo University of Science
Beijing Forestry University
Beijing Shi, China
Patent: 1
Ivano-Frankivsk National Technical University of Oil & Gas
Shanghai University of Engineering Science
Shanghai Shi, China
Patent: 1