Search results for “Signal validation” companies
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Key Players
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Innovation Intensity
With the analysis among 461 patents, we discovered top 253 key players by total patent application. Westinghouse Electric Co. LLC, Robert Bosch GmbH, Koninklijke Philips NV are dominant in this area. They take 7.16% of the total patent filing.
Westinghouse Electric Co. LLC
Gansu Sheng, China
Patent: 13
Robert Bosch GmbH
Baden-Württemberg, Germany
Patent: 11
Koninklijke Philips NV
Noord-Holland, Netherlands
Patent: 9
Symbotic LLC
Massachusetts, United States
Patent: 7
Techtronic Cordless GP
South Carolina, United States
Patent: 7
Samsung Electronics Co., Ltd.
South Korea
Patent: 5
Honda Lock Mfg Co., Ltd.
Miyazaki-ken, Japan
Patent: 5
STMicroelectronics SA
France
Patent: 5
ESB, Inc.
Delaware, United States
Patent: 5
Honeywell International Technologies Ltd.
DUBLIN, Ireland
Patent: 5
Startups & Unicorns
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Innovation Intensity
With the analysis among 14 patents, we discovered top 7 start-ups by total patent application. 12cm, Inc., Emteq Ltd., Envisics Ltd. are active in this area.
STARTUP
12cm, Inc.
Gyeonggi-do, South Korea
Patent: 4
STARTUP
Emteq Ltd.
East Sussex, United Kingdom
Patent: 3
STARTUP
Envisics Ltd.
United Kingdom
Patent: 2
STARTUP
SSenstone Co., Ltd.
Gyeonggi-do, South Korea
Patent: 2
STARTUP
KIOXIA Corp.
Tokyo-to, Japan
Patent: 1
STARTUP
Suzhou Jimu Robot Technology Co., Ltd.
Jiangsu Sheng, China
Patent: 1
STARTUP
Yangtze Memory Technologies Co., Ltd.
Hubei Sheng, China
Patent: 1
Fast-Growing
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Innovation in recent 5 years
With the analysis among related 165 patents applied in the last 5 years. We discover 118 most active companies in this area. The fast-growing Techtronic Cordless GP, Symbotic LLC, Beijing Ruikelai Technology Co.,Ltd. take 9.09% of patent filing during this period.
Techtronic Cordless GP
South Carolina, United States
Patent: 7
Symbotic LLC
Massachusetts, United States
Patent: 4
Beijing Ruikelai Technology Co.,Ltd.
Beijing Shi, China
Patent: 4
DexCom, Inc.
California, United States
Patent: 3
STMicroelectronics SA
France
Patent: 3
Harman International Industries, Inc.
Connecticut, United States
Patent: 3
Syqe Medical Ltd.
Israel
Patent: 3
MediaTek, Inc.
Taiwan Province, China
Patent: 3
Volkswagen AG
Niedersachsen, Germany
Patent: 3
Manicka Institute LLC
United States
Patent: 3
New Entrants
Order by:
Innovation in recent 5 years
With the analysis among related 165 patents in last 5 years, we discover 104 new entrants. Techtronic Cordless GP, Beijing Ruikelai Technology Co.,Ltd., DexCom, Inc. are the most active new entrants in this area.
Techtronic Cordless GP
South Carolina, United States
Patent: 7
Beijing Ruikelai Technology Co.,Ltd.
Beijing Shi, China
Patent: 4
DexCom, Inc.
California, United States
Patent: 3
Harman International Industries, Inc.
Connecticut, United States
Patent: 3
Syqe Medical Ltd.
Israel
Patent: 3
MediaTek, Inc.
Taiwan Province, China
Patent: 3
Volkswagen AG
Niedersachsen, Germany
Patent: 3
Manicka Institute LLC
United States
Patent: 3
Pegatron Corp.
Taiwan Province, China
Patent: 3
STARTUP
Emteq Ltd.
East Sussex, United Kingdom
Patent: 3
Research Institutions
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Innovation Intensity
With the analysis among 29 patents, we discovered top 14 universities and scientific research institutions by total patent application. University of South Florida, University of Electronic Science & Technology of China, Rutgers State University of New Jersey are dominant in this area. They take 20.69% of the total patent filing.
University of South Florida
United States
Patent: 2
University of Electronic Science & Technology of China
Sichuan Sheng, China
Patent: 2
Rutgers State University of New Jersey
New Mexico, United States
Patent: 1
The University of Chicago
Illinois, United States
Patent: 1
Xi'an Jiaotong University
Shaanxi Sheng, China
Patent: 1
Beijing University of Technology
Beijing Shi, China
Patent: 1
China University of Petroleum (East China)
Shandong Sheng, China
Patent: 1
Beijing University of Posts & Telecommunications
Beijing Shi, China
Patent: 1
Xidian University
Shaanxi Sheng, China
Patent: 1
Nanjing University of Aeronautics & Astronautics
Jiangsu Sheng, China
Patent: 1
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