With the analysis among 35 patents, we discovered top 25 key players by total patent application. QLT, Inc., The Chemours Co., Weifang Startech Microelectronic Materials Co., Ltd. are dominant in this area. They take 28.57% of the total patent filing.
British Columbia, Canada
Patent: 4
Delaware, United States
Patent: 3
Shandong Sheng, China
Patent: 3
Kanagawa-ken, Japan
Patent: 1
Taiwan Province, China
Patent: 1
STIRLING, United Kingdom
Patent: 1
Tianjin Shi, China
Patent: 1
With the analysis among 1 patents, we discovered top 1 start-ups by total patent application.
Tianjin Shi, China
Patent: 1
With the analysis among related 37 patents applied in the last 5 years. We discover 30 most active companies in this area. The fast-growing Wayne State University Board of Governors, The Chemours Co., Weifang Startech Microelectronic Materials Co., Ltd. take 27.03% of patent filing during this period.
Delaware, United States
Patent: 3
Shandong Sheng, China
Patent: 3
Shanghai Shi, China
Patent: 2
Anhui Sheng, China
Patent: 1
Hubei Sheng, China
Patent: 1
Shandong Sheng, China
Patent: 1
With the analysis among related 37 patents in last 5 years, we discover 29 new entrants. The Chemours Co., Weifang Startech Microelectronic Materials Co., Ltd., Osaka University are the most active new entrants in this area.
Delaware, United States
Patent: 3
Shandong Sheng, China
Patent: 3
Shanghai Shi, China
Patent: 2
Anhui Sheng, China
Patent: 1
Hubei Sheng, China
Patent: 1
Shandong Sheng, China
Patent: 1
Gansu Sheng, China
Patent: 1
With the analysis among 28 patents, we discovered top 17 universities and scientific research institutions by total patent application. Osaka University, Donghua University, Dalian University are dominant in this area. They take 42.86% of the total patent filing.
Shanghai Shi, China
Patent: 2
Liaoning Sheng, China
Patent: 2
Beijing Shi, China
Patent: 1
Sichuan Sheng, China
Patent: 1
Jiangsu Sheng, China
Patent: 1
Pennsylvania, United States
Patent: 1
Hubei Sheng, China
Patent: 1
Shandong Sheng, China
Patent: 1
Beijing Shi, China
Patent: 1