Search results for “Thermosonic bonding” companies
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Key Players
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Innovation Intensity
With the analysis among 74 patents, we discovered top 33 key players by total patent application. International Business Machines Corp., Micron Technology, Inc., Wolfspeed, Inc. are dominant in this area. They take 28.38% of the total patent filing.
New York, United States
Patent: 9
Idaho, United States
Patent: 6
North Carolina, United States
Patent: 6
New York, United States
Patent: 4
Tokyo-to, Japan
Patent: 3
Arizona, United States
Patent: 3
Kulicke & Soffa Industries, Inc.
Central Region, Singapore
Patent: 3
California, United States
Patent: 2
Ohio, United States
Patent: 2
United Kingdom
Patent: 2
Startups & Unicorns
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Innovation Intensity
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Fast-Growing
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Innovation in recent 5 years
With the analysis among related 9 patents applied in the last 5 years. We discover 6 most active companies in this area. The fast-growing Microchip Technology, Inc., Rockley Photonics Ltd., East China Institute of Optoelectronic Integrated Devices take 66.67% of patent filing during this period.
Arizona, United States
Patent: 3
United Kingdom
Patent: 2
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Patent: 1
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Patent: 1
Guangdong Sheng, China
Patent: 1
Chongqing Shi, China
Patent: 1
New Entrants
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Innovation in recent 5 years
With the analysis among related 9 patents in last 5 years, we discover 6 new entrants. Microchip Technology, Inc., Rockley Photonics Ltd., East China Institute of Optoelectronic Integrated Devices are the most active new entrants in this area.
Arizona, United States
Patent: 3
United Kingdom
Patent: 2
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Patent: 1
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Patent: 1
Guangdong Sheng, China
Patent: 1
Chongqing Shi, China
Patent: 1
Research Institutions
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Innovation Intensity
With the analysis among 6 patents, we discovered top 4 universities and scientific research institutions by total patent application. Central South University, National Chung Cheng University, Shanghai University are dominant in this area. They take 50.00% of the total patent filing.
Hunan Sheng, China
Patent: 1
Taiwan Province, China
Patent: 1
Shanghai Shi, China
Patent: 1
Tianjin Shi, China
Patent: 1
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