Search results for “Under bump metallurgy” companies
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Key Players
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Innovation Intensity
With the analysis among 725 patents, we discovered top 67 key players by total patent application. Taiwan Semiconductor Manufacturing Co., Ltd., Advanced Semiconductor Engineering, Inc., Samsung Electronics Co., Ltd. are dominant in this area. They take 61.38% of the total patent filing.
Taiwan Province, China
Patent: 249
Taiwan Province, China
Patent: 143
South Korea
Patent: 53
Taiwan Province, China
Patent: 26
Taiwan Province, China
Patent: 26
New York, United States
Patent: 18
China
Patent: 15
Taiwan Province, China
Patent: 14
Taiwan Province, China
Patent: 10
Central Singapore, Singapore
Patent: 10
Startups & Unicorns
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Innovation Intensity
With the analysis among 1 patents, we discovered top 1 start-ups by total patent application.
STARTUP
California, United States
Patent: 1
Fast-Growing
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Innovation in recent 5 years
With the analysis among related 86 patents applied in the last 5 years. We discover 15 most active companies in this area. The fast-growing Taiwan Semiconductor Manufacturing Co., Ltd., Samsung Electronics Co., Ltd., GlobalFoundries U.S., Inc. take 80.23% of patent filing during this period.
Taiwan Province, China
Patent: 45
South Korea
Patent: 21
California, United States
Patent: 3
Taiwan Province, China
Patent: 3
New York, United States
Patent: 3
South Korea
Patent: 1
Texas, United States
Patent: 1
Taiwan Province, China
Patent: 1
South Korea
Patent: 1
Canada
Patent: 1
New Entrants
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Innovation in recent 5 years
With the analysis among related 86 patents in last 5 years, we discover 5 new entrants. SOCPRA-Sciences et Génie S.E.C., IBM China Company Limited., Cirrus Logic, Inc. are the most active new entrants in this area.
Canada
Patent: 1
Shanghai Shi, China
Patent: 1
Texas, United States
Patent: 1
CITY OF SCOTLAND, United Kingdom
Patent: 1
South Korea
Patent: 1
Research Institutions
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Innovation Intensity
With the analysis among 18 patents, we discovered top 6 universities and scientific research institutions by total patent application. The Hong Kong University of Science & Technology, National Tsing-Hua University, National Central University are dominant in this area. They take 38.89% of the total patent filing.
The Hong Kong University of Science & Technology
Hong Kong SAR, China
Patent: 2
Taiwan Province, China
Patent: 2
Taiwan Province, China
Patent: 2
South Korea
Patent: 2
Taiwan Province, China
Patent: 1
South Korea
Patent: 1
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