Search results for “Virtual platform” companies
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Key Players
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Innovation Intensity
With the analysis among 460 patents, we discovered top 205 key players by total patent application. Nicira, Inc., Intel Corp., Huawei Technologies Co., Ltd. are dominant in this area. They take 12.17% of the total patent filing.
Nicira, Inc.
California, United States
Patent: 22
Intel Corp.
California, United States
Patent: 18
Huawei Technologies Co., Ltd.
Guangdong Sheng, China
Patent: 16
ZTE Corp.
Guangdong Sheng, China
Patent: 13
Zhengzhou Yunhai Information Technology Co., Ltd.
Henan Sheng, China
Patent: 13
Safran Electronics & Defense SAS
France
Patent: 10
Shenzhen Shenxinfu Electronic Science & Technology Co., Ltd.
Guangdong Sheng, China
Patent: 9
Inspur Electronic Information Industry Co., Ltd.
Shandong Sheng, China
Patent: 8
Shanghai Aishu Software Co. Ltd.
Shanghai Shi, China
Patent: 8
PT Nokia Corp.
Jakarta Raya, Indonesia
Patent: 8
Startups & Unicorns
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Innovation Intensity
With the analysis among 5 patents, we discovered top 3 start-ups by total patent application.
Qi An Xin Technology Group, Inc.
Beijing Shi, China
Patent: 2
STARTUP
Neosensory, Inc.
California, United States
Patent: 2
Beijing Baidu Netcom Science & Technology Co., Ltd.
Beijing Shi, China
Patent: 1
Fast-Growing
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Innovation in recent 5 years
With the analysis among related 179 patents applied in the last 5 years. We discover 118 most active companies in this area. The fast-growing Industrial Technology Research Institute, Intel Corp., Suzhou Inspur Intelligent Technology Co., Ltd. take 7.26% of patent filing during this period.
Industrial Technology Research Institute
Taiwan Province, China
Patent: 5
Intel Corp.
California, United States
Patent: 4
Suzhou Inspur Intelligent Technology Co., Ltd.
Jiangsu Sheng, China
Patent: 4
Shanghai Information2 Software, Inc.
Shanghai Shi, China
Patent: 4
State Grid Corp. of China
Beijing Shi, China
Patent: 3
Nagravision SARL
Vaud, Switzerland
Patent: 3
Harbin Engineering University
Heilongjiang Sheng, China
Patent: 2
Evermore Systems, Inc.
Texas, United States
Patent: 2
Liaoning Province Power Co. Ltd.
Liaoning Sheng, China
Patent: 2
Automotive Data of China (Tianjin) Co.,Ltd.
Tianjin Shi, China
Patent: 2
New Entrants
Order by:
Innovation in recent 5 years
With the analysis among related 179 patents in last 5 years, we discover 101 new entrants. Shanghai Information2 Software, Inc., Nagravision SARL, Harbin Engineering University are the most active new entrants in this area.
Shanghai Information2 Software, Inc.
Shanghai Shi, China
Patent: 4
Nagravision SARL
Vaud, Switzerland
Patent: 3
Harbin Engineering University
Heilongjiang Sheng, China
Patent: 2
Evermore Systems, Inc.
Texas, United States
Patent: 2
Liaoning Province Power Co. Ltd.
Liaoning Sheng, China
Patent: 2
Automotive Data of China (Tianjin) Co.,Ltd.
Tianjin Shi, China
Patent: 2
Allwinner Technology Co., Ltd.
Guangdong Sheng, China
Patent: 2
Southeast University
Jiangsu Sheng, China
Patent: 2
China Telecom Corp. Ltd.
Beijing Shi, China
Patent: 2
Beijing Yunshu Innovation Software Technology Co., Ltd.
Beijing Shi, China
Patent: 2
Research Institutions
Order by:
Innovation Intensity
With the analysis among 95 patents, we discovered top 38 universities and scientific research institutions by total patent application. National Taiwan University, Huazhong University of Science & Technology, Xi'an University of Science & Technology are dominant in this area. They take 16.84% of the total patent filing.
National Taiwan University
Taiwan Province, China
Patent: 3
Huazhong University of Science & Technology
Hubei Sheng, China
Patent: 3
Xi'an University of Science & Technology
Shaanxi Sheng, China
Patent: 3
Zhejiang University
Zhejiang Sheng, China
Patent: 2
Beihang University
Beijing Shi, China
Patent: 2
National Chung Cheng University
Taiwan Province, China
Patent: 2
Harbin Engineering University
Heilongjiang Sheng, China
Patent: 2
Institute of Computing Technology Chinese Academy of Sciences
Beijing Shi, China
Patent: 2
Southeast University
Jiangsu Sheng, China
Patent: 2
Southwest University
Chongqing Shi, China
Patent: 2
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