Search results for “Wedge bonding” companies
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Key Players
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Innovation Intensity
With the analysis among 644 patents, we discovered top 200 key players by total patent application. Nippon Steel Co., Ltd., Nippon Micrometal Corp., Tanaka Denshi Kogyo KK are dominant in this area. They take 18.17% of the total patent filing.
Osaka-fu, Japan
Patent: 64
Saitama-ken, Japan
Patent: 32
Saga-ken, Japan
Patent: 21
Tokyo-to, Japan
Patent: 20
Tokyo-to, Japan
Patent: 17
Hessen, Germany
Patent: 17
Aichi-ken, Japan
Patent: 15
Tokyo-to, Japan
Patent: 13
Japan
Patent: 13
California, United States
Patent: 12
Startups & Unicorns
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Innovation Intensity
With the analysis among 4 patents, we discovered top 3 start-ups by total patent application.
Fast-Growing
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Innovation in recent 5 years
With the analysis among related 65 patents applied in the last 5 years. We discover 34 most active companies in this area. The fast-growing Nippon Steel Co., Ltd., Mitsubishi Electric Corp., Shinkawa KK take 32.31% of patent filing during this period.
Osaka-fu, Japan
Patent: 9
Tokyo-to, Japan
Patent: 6
Japan
Patent: 6
Atieva, Inc.
California, United States
Patent: 4
Saga-ken, Japan
Patent: 4
Saitama-ken, Japan
Patent: 4
Kulicke & Soffa Industries, Inc.
Central Region, Singapore
Patent: 3
Germany
Patent: 3
Beijing Shi, China
Patent: 3
Singapore
Patent: 3
New Entrants
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Innovation in recent 5 years
With the analysis among related 65 patents in last 5 years, we discover 20 new entrants. Atieva, Inc., Heraeus Nexensos GmbH, Youyan Engineering Technology Research Institute Co., Ltd. are the most active new entrants in this area.
Atieva, Inc.
California, United States
Patent: 4
Germany
Patent: 3
Beijing Shi, China
Patent: 3
Singapore
Patent: 3
France
Patent: 2
Jiangsu Sheng, China
Patent: 1
Jiangsu Sheng, China
Patent: 1
Bayern, Germany
Patent: 1
Zhejiang Sheng, China
Patent: 1
Beijing Shi, China
Patent: 1
Research Institutions
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Innovation Intensity
With the analysis among 29 patents, we discovered top 6 universities and scientific research institutions by total patent application. Waseda University, Central South University, China Agricultural University are dominant in this area. They take 41.38% of the total patent filing.
Tokyo-to, Japan
Patent: 5
Hunan Sheng, China
Patent: 1
Beijing Shi, China
Patent: 1
Jilin Sheng, China
Patent: 1
Jiangsu Sheng, China
Patent: 1
Heilongjiang Sheng, China
Patent: 1
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