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Beckhoff Automation GmbH & Co. KGBernecker + Rainer Industrie-Elektronik GmbHFirst International Computer, Inc.Marketech International Corp.IEI Integration Corp.Lanner Electronics Inc.Goldtek Technology Co., Ltd.RDC Semiconductor Co., Ltd.NEXCOM International Co., Ltd.Posiflex Technologies, Inc.IMI Technology Co., Ltd.IBASE Technology, Inc.Axiomtek Co., Ltd.Anderson Industrial Corp.Ennoconn Corp.ASRock, Inc.Avalue Technology, Inc.Pyramid Computer GmbHFFG Werke GmbHJetter AGCaswell, Inc.AEWIN Technologies Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Konica Minolta, Inc.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.Electronics & Telecommunications Research Institute
Kubota Corp.MagnaChip Semiconductor Ltd.JATCO Ltd.Quanta Computer, Inc.Advanced Semiconductor Engineering, Inc.Lite-On Technology Corp.New York Air Brake Corp.Toyota Motor Engineering & Manufacturing North America, Inc.Nerudia Ltd.Daido Kogyo Co., Ltd.Grifols SAInnovation First, Inc.Kobelco Research Institute, Inc.Meiko Electronics Co., Ltd.Ionics, Inc.First International Computer, Inc.Jabil, Inc.Kimball International, Inc.Jingye Iron & Steel Co., Ltd.Universal Scientific Industrial Co., Ltd.HANA MICRON, Inc.CompoSecure LLCSolus Advanced Materials Co., Ltd.Labixiaoxin (Fujian) Food Industry Co., Ltd.Labixiaoxin (Fujian) Food Industry Co., Ltd.Hatco Corp.Photop Technologies, Inc.Jiangsu Jingjiang Transformer Co., Ltd.Beijing Weina Star Technology Co. Ltd.Jiangsu Jingjiang Transformer Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
Xi'an Sinochip Semiconductors Co., Ltd.Wix.com Ltd.Chongqing Polycomp International Corp.Chongqing Polycomp International Corp.Orient Semiconductor Electronics Ltd.Shenzhen Huion Animation Technology Co. Ltd.NingXia XN Automation Equipment Co., Ltd.NingXia XN Automation Equipment Co., Ltd.Knig + Neurath AGUnited Memories, Inc.Tela Innovations, Inc.Shenzhen Chipsbank Technologies Co., Ltd.Cybersonics, Inc.Beijing UniStrong Science & Technology Co., Ltd.IDEEMATEC Deutschland GmbHPeddinghaus CorpOber SAV-shapes SrlI&T GmbHSunfolding, Inc.Suzhou Juneng Machine Vision Technology Co., Ltd.Universal Electric Corp.Best Technology (Shenzhen), Inc.Steinmüller Engineering GmbHAB Connectors Ltd.Baoruh Electronic Co., Ltd.Accelerated Systems, Inc.Winkk, Inc.Coretec, Inc.Jedat Inc.