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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
Samsung Electronics Co., Ltd.Toyota Motor Corp.Huawei Technologies Co., Ltd.Apple, Inc.OppoNTT DOCOMO, Inc.Fujikura Ltd.Datang Mobile Communications Equipment Co. Ltd.BlackBerry Ltd.Xiaomi Corp.KDDI Corp.China United Network Communications Ltd.Motorola Mobility LLCMotorola Solutions Credit Co. LLCOrange SAGoerTek Inc.Deutsche Telekom AGChina Telecom Corp. Ltd.McNeil-PPC, Inc.Toyo Ink SC Holdings Co. Ltd.Giesecke+Devrient GmbHWalmart LabsLear Corp.Skyworks Solutions, Inc.Chunghwa Picture Tubes Ltd.PayPal, Inc.Shenzhen Royole Technologies Co., Ltd.Shenzhen Royole Technologies Co., Ltd.LG Uplus Corp.Meizu Technology Co. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.
Toyota Motor Corp.Seiko Epson Corp.Honda Motor Co., Ltd.DENSO Corp.Midea Group Co. Ltd.Yamaha Motor Co., Ltd.FANUC Corp.Iseki & Co., Ltd.Hilti AGYASKAWA Electric Corp.SZ DJI Technology Co., Ltd.DAEWOO SHIPBUILDING & MARINE ENGINEERING Co., Ltd.NVIDIA Corp.JD.com, Inc.Miele & Cie. KGDana-Farber Cancer Institute, Inc.Mattel, Inc.Husqvarna ABLEGO A/SHaldor Topse A/SLEGO A/SNational Aeronautics & Space AdministrationThe Shenzhen Institutes of Advanced TechnologyThe Shenzhen Institutes of Advanced TechnologyWaymo LLCSRI InternationalRyobi Ltd.Shibuya Corp.Tatsuno Corp.Nachi-Fujikoshi Corp.
Corephotonics Ltd.cynora GmbHProfound Medical, Inc.Profound Medical, Inc.Invivo Corp.ControlRad, Inc.Pixim, Inc.Volk Optical, Inc.Droplet Technology, Inc.Genoa Color Technologies Ltd.JENETRIC GmbHintoPIX SARed.com, Inc.ALS Automated Lab Solutions GmbHLightSpace Technologies SIAiCatch Technology, Inc.EpiCrystals OyUltraSPECT Ltd.Xenocor, Inc.Mamea Imaging ABMedic Vision Imaging Solutions Ltd.Nippon Techno Lab, Inc.Real-Time Radiography, Inc.iTomography Corp.Automation Engineering, Inc.AIRY3D, Inc.Tursiop Technologies LLCAcuitas Medical Ltd.A-Volute SASMedical Insight A/S
Samsung Electronics Co., Ltd.Fujitsu Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoMotorola, Inc.NTT DOCOMO, Inc.Haier Smart Home Co., Ltd.BYD Co., Ltd.British Telecommunications PlcJVCKenwood Corp.Xiaomi Corp.Motorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.Wuhan China Star Optoelectronics Technology Co., Ltd.Wuhan China Star Optoelectronics Technology Co., Ltd.Huizhou TCL Mobile Communication Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Konka Group Co., Ltd.Primax Electronics Ltd.LG Uplus Corp.Meizu Technology Co. Ltd.Pantech & Curitel Communications, Inc.LARGAN Precision Co., Ltd.Lemobile Information Technology Beijing Co., Ltd.AAC Acoustic Technologies (Shenzhen) Co., Ltd.Gionee Communication Equipment Co. Ltd.Sanechips Technology Co., Ltd.
Samsung Electronics Co., Ltd.Micron Technology, Inc.MagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Gentex Corp.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.Unity Opto Technology Co., Ltd.Rockley Photonics Ltd.IHP GmbH - Innovations for High Performance MicroelectronicsInvensas Bonding Technologies, Inc.National Chi Nan UniversityFoveon, Inc.MOBOTIX AGAvnera Corp.Tung Thih Electronic Co., Ltd.Skorpios Technologies, Inc.Lightmatter, Inc.Brigates Microelectronics Inc.Tower Semiconductor Ltd.Pixelplus Co., Ltd.Akustica, Inc.AmberWave Systems Corp.MEMSIC, Inc.Sofics BVBASilicon Optronics, Inc.Insiava Pty Ltd.Xiroku, Inc.New Imaging Technologies SADecaWave Ltd.