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SICPA Holding SAFujitsu Frontech Ltd.Feitian Technologies Co., Ltd.Nations Technologies, Inc.Gen Digital Inc.NortonLifeLock, Inc.CEC Huada Electronic Design Co., Ltd.Chaoyang University of TechnologySpectra Systems Corp.SOFTBANK BB Corp.Synthesis Electronic Technology Co., Ltd.Synthesis Electronic Technology Co., Ltd.Zwipe ASSSenstone Co., Ltd.Cross Match Technologies, Inc.CSC Jinling Shipyard Co, Ltd.DocuSign, Inc.Pindrop Security, Inc.CardinalCommerce Corp.Verifi, Inc.BOKU, Inc.myPINpad Ltd.Master Dynamic Ltd.Authentix, Inc.Thales DIS CPL USA, Inc.DSS, Inc.CX Ignited SASNok Nok Labs, Inc.XGD, Inc.Meyercord Revenue, Inc.
SecuGen Corp.Iridian Technologies, Inc.Next Biometrics Group ASUPEK, Inc.Cassis International Pte. Ltd.CoreStreet Ltd.TruU, Inc.Sera4 Ltd.Biometric Associates LPViscount Systems, Inc.Accu-Time Systems, Inc.Alert Enterprise, Inc.SensiPass Ltd.PrivateCore, Inc.
Ricoh Co., Ltd.Ricoh Co., Ltd.Hewlett-Packard Development Co.Eastman Kodak Co.Dai Nippon Printing Co., Ltd.Konica Minolta, Inc.Koninklijke DSM NVMassachusetts Institute of TechnologyNGK SPARK PLUG CO., LTD.Saudi Arabian Oil Co.Mitsubishi Paper Mills Ltd.Kennametal, Inc.Unisys Corp.Tachi-S Co., Ltd.Tokyo Seimitsu Co., Ltd.Waymo LLCLenzing AGSMS group GmbHSandvik AktiebolagManroland Sheetfed GmbHMimaki Engineering Co., Ltd.Hoeganaes Corp.Align Technology, Inc.Draper, Inc.IDEC Corp.Greatbatch Ltd.Widex A/SWidex A/S3D Systems, Inc.Autodesk, Inc.
Gstarsoft Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
PPG Industries Ohio, Inc.ISCAR Ltd.Sandvik AktiebolagKurimoto Ltd.Senju Metal Industry Co., Ltd.Hoeganaes Corp.Nippon Piston Ring Co., Ltd.Amgen Research (Munich) GmbHENGEL AUSTRIA GmbHHitachi Powdered Metals Co., Ltd.OSAKA Titanium Technologies Co., Ltd.Lonza, Inc.Japan Carlit Co., Ltd.ALD Vacuum Technologies GmbHAdvanced Technology & Materials Co., Ltd.Fukuda Metal Foil & Powder Co., Ltd.Fukuda Metal Foil & Powder Co., Ltd.Mpi, Inc.Comadur SAHenan Huanghe Whirlwind Co., Ltd.Hitachi Metals Precision Ltd.Heraeus Precious Metals North America Conshohocken LLCMegaGen Implant Co., Ltd.Aubert & Duval SAConcept Laser GmbHSLM Solutions Group AGXiamen Golden Egret Special Alloy Co., Ltd.Taisei Kogyo Co., Ltd.OECHSLER AGAperam SA