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Hierstar Ltd.Beijing Capital Eco-Environment Protection Group Co., Ltd.EMS Technologies LLCWRc PlcSchlumberger Resource Management ServicesCasella Waste Systems, Inc.Micronet Ltd.Spireon, Inc.AMX LLCIontas, Inc.Then Ltd.API Healthcare Corp.Enigmatec Corp. Ltd.Shenzhen Renyong Electronic System Co., Ltd.Entuity Ltd.Turbonomic, Inc.Arkivio, Inc.Utility Associates, Inc.Suzhou Bona Xundong Software Co. Ltd.Imatec Ltd.Mobile Aspects, Inc.@Road, Inc.Sequel Technology Corp.ACME Technologies, Inc.Suez RR IWS SASAboutTime Technologies LLCMaior SRLNumerica Corp.ENGIE Insight Services, Inc.Nextek Ltd.
International Business Machines Corp.Fujitsu Ltd.Eastman Kodak Co.Google LLC3M Co.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Beijing Xiaomi Mobile Software Co., Ltd.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Deutsche Telekom AGAdobe, Inc.Gemalto, Inc.Sega Group Corp.Beijing Jingdong Shangke Information Technology Co., Ltd.Beijing Jingdong Shangke Information Technology Co., Ltd.Orion Co., Ltd.LEGO A/SLEGO A/SVMware, Inc.NetEase (Hangzhou) Network Co., Ltd.Altera Corp.SK Planet Co., Ltd.Avaya, Inc.HGST, Inc.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.Nuance Communications, Inc.Sandvik AktiebolagCA Technologies, Inc.
Shenzhen SDG Information Co., Ltd.Hefei Gold Star M &E Technical Development Co. Ltd.Shenzhen Bominwell Robotics Co. Ltd.Shenzhen Bominwell Robotics Co. Ltd.Jiangsu Daybright Intelligent Electric Co., Ltd.Guangdong Nenglong Education Co., Ltd.Wuhan Bluestar Technology Co., Ltd.Guangdong Tecsun Science & Technology Co., Ltd.Beijing JAYA Technology Co., Ltd.National Information Society AgencyWuhan Huaan Science & Technology Co., Ltd.China Telecommunications Corp.Xiaobao Online Hangzhou Technology Co. Ltd.Hainan Smart City Technology Development Co., Ltd.Xiamen 35.Com Technology Co., Ltd.
EP Minerals LLCChangshu Guorui Technology Co., Ltd.Thermal Ceramics, Inc.Eucatex SA Industria e ComercioLinco, Inc.Calsitherm Verwaltungs GmbHEnvea SAPalabora Mining Co.Jiangsu Zhongnan Construction Group Co., Ltd.Profiltra BV
Semiconductor Components Industries LLCSEMES Co., Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Polaris Innovations Ltd.Siliconware Precision Industries Co., Ltd.Qimonda AGPowertech Technology, Inc.JCET Group Co., Ltd.AT & S Austria Technologie & Systemtechnik AGXintec, Inc.Amkor Technology, Inc.NEPES Corp.Camtek Ltd.Niko Semiconductor Co., Ltd.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Seoul National UniversityFlipChip International LLCADL Engineering, Inc.Deca Technologies, Inc.Tera Probe, Inc.CONNECTEC JAPAN Corp.Palomar Technologies, Inc.Macrotech Technology, Inc.Macrotech Technology, Inc.Murata Electronics North America, Inc.GE Embedded Electronics Oy
Semiconductor Components Industries LLCShinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Synopsys, Inc.Polaris Innovations Ltd.Qimonda AGChipMOS Technologies, Inc.Powertech Technology, Inc.Xintec, Inc.NEPES Corp.Camtek Ltd.Subtron Technology Co., Ltd.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Zuken Ltd.Seoul National UniversityShanghai Meadville Science & Technology Co., Ltd.FlipChip International LLCADL Engineering, Inc.Tera Probe, Inc.Macrotech Technology, Inc.Macrotech Technology, Inc.Silvaco, Inc.Murata Electronics North America, Inc.Nexsem, Inc.Integrated System Assemblies Corp.GE Embedded Electronics OyWest Bond, Inc.
Taiwan Semiconductor Manufacturing Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Semiconductor Components Industries LLCSEMES Co., Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Fujitsu Semiconductor Ltd.Advanced Semiconductor Engineering, Inc.Nanya Technology Corp.Polaris Innovations Ltd.Siliconware Precision Industries Co., Ltd.Qimonda AGSTATS ChipPAC Pte Ltd.Invensas Corp.Powertech Technology, Inc.JCET Group Co., Ltd.AT & S Austria Technologie & Systemtechnik AGXintec, Inc.King Yuan Electronics Co., Ltd.Chipbond Technology Corp.Amkor Technology, Inc.NEPES Corp.Advanced Chip Engineering Technology, Inc.HANA MICRON, Inc.Camtek Ltd.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Micron Technology Taiwan, Inc.Seoul National University
