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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
Semiconductor Components Industries LLCSEMES Co., Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Polaris Innovations Ltd.Siliconware Precision Industries Co., Ltd.Qimonda AGPowertech Technology, Inc.JCET Group Co., Ltd.AT & S Austria Technologie & Systemtechnik AGXintec, Inc.Amkor Technology, Inc.NEPES Corp.HANA MICRON, Inc.Camtek Ltd.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Seoul National UniversityTrust Alliance Information Development Inc., Ltd. ShanghaiFlipChip International LLCADL Engineering, Inc.Tera Probe, Inc.CONNECTEC JAPAN Corp.Palomar Technologies, Inc.Macrotech Technology, Inc.Macrotech Technology, Inc.Murata Electronics North America, Inc.GE Embedded Electronics Oy
Taiwan Semiconductor Manufacturing Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Semiconductor Components Industries LLCSEMES Co., Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Fujitsu Semiconductor Ltd.Advanced Semiconductor Engineering, Inc.Nanya Technology Corp.Polaris Innovations Ltd.Siliconware Precision Industries Co., Ltd.Qimonda AGSTATS ChipPAC Pte Ltd.ChipMOS Technologies, Inc.Powertech Technology, Inc.JCET Group Co., Ltd.AT & S Austria Technologie & Systemtechnik AGXintec, Inc.Chipbond Technology Corp.Amkor Technology, Inc.NEPES Corp.Advanced Chip Engineering Technology, Inc.Camtek Ltd.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Micron Technology Taiwan, Inc.Seoul National UniversityTrust Alliance Information Development Inc., Ltd. ShanghaiFlipChip International LLC
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.
Fraunhofer-Gesellschaft eVToyota Central R&D Labs, Inc.Semiconductor Components Industries LLCShinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Polaris Innovations Ltd.Dowa Electronics Materials Co., Ltd.Arizona State UniversitySiliconware Precision Industries Co., Ltd.Qimonda AGInternational Rectifier Corp.STATS ChipPAC Pte Ltd.ChipMOS Technologies, Inc.Nuvoton Technology Corp.Powertech Technology, Inc.JCET Group Co., Ltd.eMemory Technology, Inc.Hitachi AIC, Inc.SANYO Semiconductor Co., Ltd.Xintec, Inc.Etron Technology, Inc.Chipbond Technology Corp.Shenzhen Sunlord Electronics Co., Ltd.Amkor Technology, Inc.Princo Corp.NEPES Corp.Xiamen San'an Integrated Circuit Co., Ltd.Camtek Ltd.Xiamen San'an Integrated Circuit Co., Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd.Casio Computer Co., Ltd.Showa Denko K.K.Resonac Holdings Corp.DISCO Corp.Shin-Etsu Handotai Co., Ltd.Shibaura Mechatronics Corp.Advanced Semiconductor Engineering, Inc.EPISTAR Corp.Soitec SATokyo Seimitsu Co., Ltd.Atotech Deutschland GmbHVarian Semiconductor Equipment Associates, Inc.Fujimi, Inc.Siltronic AGNovuton Technology Corp. JapanZhejiang Jinko Solar Co. Ltd.Hirata Corp.Cymer LLCGlobalWafers Co., Ltd.Genesis Photonics, Inc.Mattson Technology, Inc.Xintec, Inc.EGing Photovoltaic Technology Co., Ltd.Xiamen San'an Optoelectronics Technology Co., Ltd.Xiamen San'an Optoelectronics Technology Co., Ltd.Fujikoshi Machinery Corp.Guilford Pharmaceuticals, Inc.Guangdong Fenghua Advanced Technology (Holding) Co., Ltd.SK Siltron Co., Ltd.
Kobe Steel, Ltd.POSCO Holdings Inc.JFE Holdings, Inc.IBIDEN Co., Ltd.Sintokogio Ltd.Noritake Co., Ltd.Ryobi Ltd.Foseco International Ltd.Fujimi, Inc.Elkem ASANovuton Technology Corp. JapanTokai Carbon Co., Ltd.Vanguard International Semiconductor Corp.Vanguard International Semiconductor Corp.Tata Steel Ltd.Toyo Tanso Co., Ltd.ChipMOS Technologies, Inc.Showa Manufacturing Co., Ltd.KUKA Deutschland GmbHeMemory Technology, Inc.Datong Xincheng New Material Co., Ltd.Datong Xincheng New Material Co., Ltd.Uddeholms ABG. Siempelkamp GmbH & Co. KGGiga Device Semiconductor, Inc.Nippon Yakin Kogyo Co., Ltd.Giga Device Semiconductor (Beijing), Inc.Gebr Eickhoff Maschinenfabrik & Eisengiesserei GmbHVereinigte Edelstahlwerke AGNewell Operating Co.