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Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Toshiba Chemical Corp.Kyocera Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.
Electronics & Telecommunications Research InstituteYamaha Corp.JVCKenwood Corp.Semiconductor Components Industries LLCAlpine Electronics, Inc.Bose Corp.Japan Radio Co. Ltd.Skyworks Solutions, Inc.Harman International Industries, Inc.Rohde & Schwarz GmbH & Co. KGJOLED, Inc.Primax Electronics Ltd.Toshiba Electronic Devices & Storage Corp.Onkyo Home Entertainment Corp.Cirrus Logic, Inc.AVIC Jonhon Optronic Technology Co., Ltd.AVIC Jonhon Optronic Technology Co., Ltd.Heraeus Precious Metals GmbH & Co. KGSonos, Inc.GTE Sylvania, Inc.GTE Sylvania, Inc.Southwire Co. LLCSTMicroelectronics International NVNuvoton Technology Corp.DX Antenna Co., Ltd.Bang & Olufsen A/SShenzhen Topband Co., Ltd.PPC Broadband, Inc.Shenzhen Sunway Communication Co., Ltd.Shenzhen Sunway Communication Co., Ltd.
Intel Corp.Seagate Technology LLCHGST, Inc.Universal Display Corp.KIOXIA Corp.Fujitsu Component Ltd.LSI Corp.Methode Electronics, Inc.ADATA Technology Co., Ltd.Bridgelux, Inc.Ostendo Technologies, Inc.Benewake (Beijing) Co. Ltd.Metalysis Ltd.Benewake (Beijing) Co. Ltd.Avalanche Technology, Inc.Biwin Storage Technology Co., Ltd.Beijing WeLion New Energy Technology Co. Ltd.Xiamen Hongfa Electroacoustic Co., Ltd.Tesat Spacecom GmbH & Co. KGBeijing WeLion New Energy Technology Co. Ltd.Inno Laser Technology Co., Ltd.Viking Technology, Inc.Phononic, Inc.Optatech OySolid State System Co., Ltd.Geomatec Co., Ltd.Ledlink Optics, Inc.Futurepath Technology (Shenzhen) Co., Ltd.Futurepath Technology (Shenzhen) Co., Ltd.Ingrasys Technology, Inc.
Ericsson, Inc.The Boeing Co.Russia Federal Space AgencyThales GroupSNECMA SAKDDI Corp.Deutsche Telekom AGDeutsches Zentrum für Luft- und Raumfahrt e.V.Hosiden Corp.National Aeronautics & Space AdministrationHuf Hülsbeck & Fürst GmbH & Co. KGAmpex Corp.FCI SAT-Mobile USA, Inc.Nagravision SANisshinbo Micro Devices, Inc.Maspro Denkoh Corp.Korea Aerospace Research InstituteViaSat, Inc.Ball Corp.Yokowo Co. Ltd.Wistron NeWeb Corp.Telefónica SASECOM Co., Ltd.Shenzhen Skyworth Digital Technology Co., Ltd.Shenzhen Skyworth Digital Technology Co., Ltd.Japan Aerospace Exploration AgencyShenzhen Coship Electronics Co., Ltd.ArianeGroup SASIsrael Aerospace Industries Ltd.
Abaco Systems, Inc.
Yidian ZixunCeno Technologies Ltd.
NovAtel, Inc.Altech Corp.Fractus SAChung-Hsin Electric & Machinery Mfg. Corp.Chung-Hsin Electric & Machinery Mfg. Corp.SUS Co., Ltd.Consolidated Metco, Inc.New Scale Technologies, Inc.FiberGuideMicron Solutions, Inc.Pacific Safety Products, Inc.PCB Piezotronics, Inc.RCR Flooring Products Ltd.BioMech Golf LLCDarcy Technologies Ltd.Orsto Ltd.Electronic Products, Inc.Premier Farnell Ltd.Thermagon, Inc.Golden Gate Technology, Inc.Helic SAIntegrated Dynamics, Inc.Atrenta, Inc.
