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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Micro Contact Solution Co., Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd.SEMES Co., Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Tokyo Seimitsu Co., Ltd.Siliconware Precision Industries Co., Ltd.MKS Instruments, Inc.Micronics Japan Co., Ltd.STATS ChipPAC Pte Ltd.ChipMOS Technologies, Inc.MPI Corp.Powertech Technology, Inc.JCET Group Co., Ltd.Namics Corp.AT & S Austria Technologie & Systemtechnik AGTongFu Microelectronics Co., Ltd.Xintec, Inc.JAPAN ELECTRONIC MATERIALS CORP.JAPAN ELECTRONIC MATERIALS CORP.HANMI Semiconductor Co., Ltd.King Yuan Electronics Co., Ltd.Chipbond Technology Corp.Amkor Technology, Inc.NEPES Corp.HANA MICRON, Inc.Walton Advanced Engineering, Inc.Subtron Technology Co., Ltd.Foshan Nationstar Semiconductor Co., Ltd.Lingsen Precision Industries Ltd.
Samsung Electronics Co., Ltd.Micron Technology, Inc.Advanced Micro Devices, Inc.Seagate Technology LLCWestern Digital Technologies, Inc.Macronix International Co., Ltd.Yangtze Memory Technologies Co., Ltd.Yangtze Memory Technologies Co., Ltd.Lite-On Technology Corp.HGST, Inc.Optoma Corp.KIOXIA Corp.Canon Anelva Corp.LSI Corp.Elecom Co., Ltd.Phison Electronics Corp.Silicon Motion Technology Corp.Everspin Technologies, Inc.Hitachi AIC, Inc.Leia, Inc.ADATA Technology Co., Ltd.LSI Industries, Inc.Zalman Tech Co., Ltd.Quanta Storage, Inc.Shenzhen Sunlord Electronics Co., Ltd.Nantero, Inc.JT Corp.Dawning Information Industry Co., Ltd.Hunan Goke Microelectronics Co., Ltd.PMD Technologies Ltd.
TRUSTEES OF THE UNIV OF PENNSYLVANIANintendo Co., Ltd.Deutsches Zentrum für Luft- und Raumfahrt e.V.Mattel, Inc.Magic Leap, Inc.LG H&H Co., Ltd.University of PittsburghNippon Sanso KKAVL List GmbHShanghai Maritime UniversityImmersion Corp.Huaiyin Institute of TechnologyGhent UniversityHitachi-GE Nuclear Energy Ltd.Sikorsky Aircraft Corp.Guangdong Polytechnic Normal UniversityUniversity of Kentucky Research FoundationSony Interactive Entertainment LLC3D Systems, Inc.Israel Aerospace Industries Ltd.Huangshan UniversityKorea University of Technology & EducationThe Ritsumeikan TrustChang Gung UniversityThe Board of Trustees of The University of AlabamaXi'an International UniversityBinder GmbHPontificia Universidad Católica de ChileLaerdal Medical ASThe Climate Corp.
